XC6SLX45-2CSG324I - 43,661-Cell Spartan-6 FPGA | AMD
料号： XC6SLX45-2CSG324I ✓ 量产中XC6SLX45-2CSG324I 概述
A field-programmable gate array is a programmable digital semiconductor that combines configurable logic, block RAM, programmable I/O, and dedicated hard intellectual property into one device. An FPGA belongs to the programmable-logic hierarchy, sitting above fixed-function logic devices and supporting parallel hardware acceleration, interface bridging, control, and signal processing. The Spartan-6 LX family combines these resources in devices intended for cost-sensitive, high-volume embedded systems.
Key resources include 43,661 logic cells, 3,411 configurable logic blocks, 2,138,112 RAM bits, and 218 I/O. The -2 suffix identifies the device speed grade, while the I suffix denotes the industrial-temperature option. The CSG324 package is a lead-free 15 mm by 15 mm surface-mount BGA with a 0.80 mm ball pitch and 324 terminals.
The Spartan-6 architecture supports programmable logic, block RAM, digital signal processing resources, memory interfaces, and selectable I/O standards. Its combination of substantial logic density and 218 user I/O allows one device to consolidate functions that might otherwise require an FPGA, microcontroller, and discrete interface logic. The 45 nm implementation also supports a broad family of industrial, consumer, communications, and automotive-infotainment designs.
Typical applications include industrial automation controllers, automotive infotainment systems, video and image-processing pipelines, communications-interface bridges, embedded control systems, and general-purpose accelerator boards. The 218-I/O package is particularly useful when a design must connect multiple buses, converters, memories, and external control signals while retaining substantial parallel-processing capability.
PCB design should follow the AMD package pinout file and the selected Spartan-6 design constraints. Place decoupling capacitors close to supply pins, preserve the required ballout and power-plane geometry, and provide a clean configuration path for reliable startup. Validate timing with the implementation tools appropriate to the installed device and speed grade.
This product record combines the verified Spartan-6 resource figures with package-specific sourcing guidance, application analysis, comparison parameters, and practical replacement-selection considerations. It is intended to help engineers distinguish true same-package options from superficially similar devices with different speed grades, temperature grades, densities, or footprints.
直接替换替代料： XC6SLX45-2CSG324I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC6SLX45-2CSG324I （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Package Dimensions, Temperature Grade, Logic Cells.
XC6SLX45-3CSG324I
✅ 直接替换联系询价
查看数据手册 →XC6SLX45-L1CSG324I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX45-2CSG324C
✅ 直接替换联系询价
查看数据手册 →XC6SLX45-2CSG324Q
✅ 直接替换📋 参考替代料（不在目录中）
XA6SLX45-2CSG324I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX45-2CSG324I 最大额定值与电气特性
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Cells | 43,661 cells |
| Configurable Logic Blocks | 3,411 CLBs |
| Total RAM | 2,138,112 bits |
| User I/O Count | 218 I/O |
| Internal Frequency | 500 MHz |
| Process Technology | 45 nm |
| Performance Grade | -2 speed grade |
| Temperature Grade | Industrial: -40 °C to +100 °C junction temperature |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Package Type | 324-LFBGA, CSBGA-324, MO-275 |
| Package Dimensions | 15 mm x 15 mm |
| Ball Pitch | 0.80 mm |
| Terminal Count | 324 terminals |
| 安装类型 | Surface-mount SMD |
| Lead-Free Status | Lead-free |
| RoHS 状态 | RoHS compliant |
| Device Family | Spartan-6 LX |
XC6SLX45-2CSG324I 15 mm x 15 mm 引脚配置指南
XC6SLX45-2CSG324I（15 mm x 15 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC6SLX45-2CSG324I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC6SLX45-2CSG324I 适用于 6 应用s: Industrial Automation Controller, Automotive Infotainment Bridge, Video and Image Processing Pipeline, Communications Interface Bridge, Embedded Control and Acquisition System, Consumer and Industrial Automation Equipment.
Industrial Automation Controller
The XC6SLX45-2CSG324I fits industrial automation because it combines 43,661 logic cells with 218 I/O while carrying the industrial-temperature suffix. Engineers can implement sequencing, motion-control interfaces, machine interlocks, sensor acquisition, and communications bridging in one device. The 45 nm Spartan-6 LX architecture allows parallel control logic to execute deterministically, while 2,138,112 RAM bits support packet buffering and local data paths. The -2 grade should be checked against the required clock and interface timing, and the PCB should follow AMD's CSG324 power and ballout requirements.
推荐
Automotive Infotainment Bridge
The XC6SLX45-2CSG324I is suitable for automotive infotainment and display-interface bridging, where programmable logic can consolidate protocol conversion and control functions. Its 218 I/O provide ample connections for display links, serializers, memory interfaces, and control peripherals, while 43,661 logic cells support parallel datapaths. The industrial-temperature designation supports equipment operating beyond typical room-temperature conditions. Designers should perform the appropriate automotive qualification review, validate timing for the selected -2 speed grade, and implement clean power distribution across the 324-ball CSBGA.
推荐
Video and Image Processing Pipeline
The XC6SLX45-2CSG324I can implement parallel video or image-processing pipelines by mapping pixel transport, thresholding, filtering, and control functions into its 43,661 logic cells. Its 2,138,112 RAM bits provide useful local line buffers, while 218 I/O accommodate data capture and interface logic. The -2 speed grade supports clocked datapath designs when the implementation meets timing constraints. Engineers should use the AMD Spartan-6 clocking and memory resources according to the target video timing, and confirm that the selected CSG324 board supports the required physical and signal interfaces.
推荐
Communications Interface Bridge
The XC6SLX45-2CSG324I is appropriate for protocol bridges that translate among serial, parallel, memory, and control interfaces. Its 218 I/O reduce the need for external glue logic, while the programmable logic fabric supports simultaneous packet processing, buffering, and state management. The 2,138,112 RAM bits can be partitioned for FIFOs or dual-port buffers. For a bridge design, engineers should constrain all interface clocks, review the selected -2 grade's timing margin, and follow the AMD CSG324 package guidance for power integrity, decoupling, and signal routing.
推荐
Embedded Control and Acquisition System
The XC6SLX45-2CSG324I supports embedded control and data-acquisition systems requiring deterministic parallel logic alongside configurable I/O. Engineers can implement sampling control, trigger sequencing, sensor conditioning logic, and memory-managed data paths without relying on a separate microcontroller for every real-time function. The 43,661-cell fabric and 218 I/O provide meaningful consolidation in compact embedded equipment. The design should include careful clock-domain boundary constraints, I/O-standard assignments compatible with external devices, and thermal verification for the industrial-temperature CSG324 package.
推荐
Consumer and Industrial Automation Equipment
The XC6SLX45-2CSG324I fits cost-sensitive high-volume equipment requiring extensive programmable logic without the complexity of a larger FPGA. Its 45 nm Spartan-6 LX implementation balances logic density, memory, and I/O availability for consumer-adjacent products and industrial automation modules. The 324-ball package supports compact board construction, although its 0.80 mm pitch requires appropriate assembly capability. Designers should verify lifecycle objectives, configure the device for robust startup, and validate both functional behavior and timing after each implementation change.
推荐
推荐产品汇总
工程参考数据： XC6SLX45-2CSG324I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC6SLX45-3CSG324I | XC6SLX45-L1CSG324I | XC6SLX45-2CSG324C | XC6SLX45-2CSG324Q | XA6SLX45-2CSG324I |
|---|---|---|---|---|---|---|
| Package | 324-ball CSBGA | 324-ball CSBGA | 324-ball CSBGA | 324-ball CSBGA | 324-ball CSBGA | 324-ball CSBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 class |
| Logic Cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells |
| RAM Bits | 2,138,112 bits | 2,138,112 bits | 2,138,112 bits | 2,138,112 bits | 2,138,112 bits | 2,138,112 bits |
| User I/O | 218 I/O | 218 I/O | 218 I/O | 218 I/O | 218 I/O | 218 I/O |
| Speed Grade | -2 | -3 | -1L | -2 | -2 | -2 |
| Temperature Grade | Industrial | Industrial | Industrial | Commercial | Q-grade option | Industrial |
| Process Technology | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm |
| Core Supply Voltage | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V |
关键差异点
- Uses the -2 performance grade within the Spartan-6 LX family （对比 XC6SLX45-3CSG324I)
- Provides the industrial-temperature suffix for embedded equipment （对比 XC6SLX45-2CSG324C)
- Retains 218 I/O and 2,138,112 RAM bits in the same 324-ball CSBGA （对比 XC6SLX45-L1CSG324I)
- Offers 43,661 logic cells for integrated control and datapath processing （对比 XC6SLX25-3CSG324I)
设计说明
Use the AMD CSG324 package drawing and ASCII ballout as the controlling sources for land patterns and electrical assignments. The package is a 15 mm by 15 mm, 324-ball BGA with 0.80 mm pitch, so small placement or registration errors can create open or shorted connections. Confirm drill, solder-mask, paste, and assembly-capability requirements with the board manufacturer before releasing the layout.
Assign every power and ground ball according to the AMD Spartan-6 package file rather than merging balls by apparent function alone. Decoupling capacitors should be placed near the corresponding device pins with short current loops, while the power and ground planes must satisfy the simultaneous switching requirements of the selected design. Validate the 1.14 V to 1.26 V core-supply range across temperature and process corners.
Do not treat a same-package FPGA as automatically interchangeable. Compare the XC6SLX45 density, -2 or alternative speed grade, I/O count, voltage configuration, temperature range, pin assignments, and block-RAM mix, then rerun timing and power analysis. Configuration compatibility also matters because existing bitstreams may need regeneration when the target device, speed grade, or design revision changes.
Estimated: device dissipation depends on the implemented design and cannot be calculated from the part number alone. Evaluate utilization, toggle rate, configured RAM, I/O activity, voltage, and ambient temperature using the AMD power tools, then add the measured or estimated junction rise to the worst-case ambient condition. The industrial suffix does not remove the need to control internal power density and board temperature.
Apply the AMD Spartan-6 I/O and clocking guidance for every external interface, including I/O standard, drive strength, slew, pull behavior, and timing constraints. Keep high-speed routes short, provide continuous reference planes where required, and separate noisy clock or power-conversion paths from sensitive inputs. Re-run implementation after any pin constraint or package-related change.
合规信息
The device is identified as RoHS compliant and lead-free in the manufacturer-family and distributor specification records. No verified automotive qualification statement, REACH declaration, halogen-free declaration, or conflict-minerals declaration was identified.
