10AS032H1F34E1HG vs 10AS032H1F35I1HG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AS032H1F34E1HG sa pamamagitan ng Intel at 10AS032H1F35I1HG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AS032H1F34E1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel (Altera)
10AS032H1F34E1HG ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | 10AS032H1F34E1HG | 10AS032H1F35I1HG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Family | Arria 10 SX | Arria 10 SX |
| Architecture | 20nm SoC FPGA (FPGA + hard ARM Cortex-A9 subsystem) | — |
| Logic Elements | 320,000 | 320K |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | — |
| On-chip Memory | Approx. 21 Mb (M20K blocks) | — |
| Transceivers | Up to 24 channels, up to 17.4 Gbps | — |
| DSP Blocks | Variable-precision hardened DSP with floating-point | — |
| Hard Memory Controllers | DDR4 up to 2133 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| PCIe Hard IP | PCIe Gen3 x8 | — |
| Packhaging | 1152-ball FCBGA (35 x 35 mm) | 1152-FBGA, FC (35x35 mm) |
| Operating Temperature (E1 suffix) | 0C to +100C (extended) | — |
| Uri ng Pagpapasok | Surface Mount, flip-chip BGA | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Pin/Ball Count | 1152 | — |
| Device Sub-Family | — | SoC FPGA |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Processor Frequency | — | 1.5 GHz |
| General Purpose I/Os | — | 384 |
| Terminal Pitch | — | 1.0 mm |
| Terminal Form | — | Ball |
| Process Technology | — | 20 nm |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Level ng MSL | — | [DATA_NEEDED: MSL Level] |
| Lead-Free | — | Yes |