10AS032H2F34I2SG vs 10AS032H2F34E2LG Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10AS032H2F34I2SG sa pamamagitan ng Intel at 10AS032H2F34E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 10AS032H2F34I2SG 10AS032H2F34E2LG
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Arria 10 SX Arria 10 SX
Logic Elements 320,000 320,000
Hard Processor System Dual ARM Cortex-A9 MPCore with CoreSight —
HPS Clock Speed (max) 1.5 GHz —
On-chip RAM (HPS) 256 KB —
Process Technology 20 nm —
Core Voltage 0.9 V —
Packhaging 1152-FBGA, FC (35x35 mm) 1152-ball FC-FBGA (F34), 35 x 35 mm
Uri ng Pagpapasok Surface Mount (flip-chip BGA) Surface Mount (BGA)
Operating Temperature Grade Industrial —
Tindminan RoHS Compliant Compliant
Lead-Free Yes —
Configuration System-on-Chip (SoC) FPGA SoC FPGA (HPS + FPGA fabric)
Number of Terminals 1152 (BGA) —
Package Code BGA (Square, Flip-Chip) —
Device Tier — 10AS032 (mid-density)
Processor Subsystem — Dual ARM Cortex-A9 MPCore with CoreSight
Maximum Operating Frequency — 1.5 GHz
Speed Grade — 2
Temperature Grade — E2 (commercial/extended)
On-chip Memory (M20K blocks) — Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet]
DSP Blocks — Variable-precision, IEEE 754 single-precision FP support
Transceivers — Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package]
Memory Controller Hard IP — DDR4, DDR3, QDRII+, RLDRAM3
Process Node — 20 nm
Form of Terminal — Ball (BGA)
Terminal Pitch — 1 mm

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