10AS057K2F35E2SG vs 10AS057K2F35E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AS057K2F35E2SG sa pamamagitan ng Intel at 10AS057K2F35E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AS057K2F35E2SG | 10AS057K2F35E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 | 570,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count for 570K LE Arria 10 SX] | — |
| Embedded Memory (M20K blocks) | [DATA_NEEDED: M20K count for 570K LE] | — |
| Embedded Memory (MLAB bits) | [DATA_NEEDED: MLAB bits for 570K LE] | — |
| DSP Blocks (18x19 Multipliers) | 1,568 | — |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Max Frequency | 1.5 GHz | 1.5 GHz |
| Maximum User I/O | 396 | — |
| Transceiver Count (GX/SX) | 24 | — |
| Transceiver Max Data Rate | 17.4 Gbps | — |
| Hard PCIe Blocks | Gen2/Gen3 x4/x8 IP | — |
| Packhaging | 1152-FBGA, FC (35x35 mm) | 1152-ball FCBGA, 35 mm x 35 mm, 1.0 mm pitch |
| Speed Grade | E2 (mid-tier) | E2 (commercial/extended) |
| Temperature na Operasyon | [DATA_NEEDED: commercial/industrial grade range] | -40C to +100C (extended-industrial screening) |
| Process Node | 20 nm (TSMC) | TSMC 20 nm |
| Uri ng Pagpapasok | Surface Mount (FCBGA) | — |
| Tindminan RoHS | Compliant (lead-free) | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| HPS Cores | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| DSP Blocks | — | [DATA_NEEDED: 18x19 multiplier count] |
| Embedded Memory (M20K) | — | [DATA_NEEDED: M20K block count and total bits] |
| Transceivers | — | Up to 24 channels, up to 17.4 Gbps |
| PCIe Hard IP | — | Gen3 x4 (rootport/endpoint) |
| User I/Os | — | 396 |
| Configuration | — | SRAM-based, partial reconfiguration, SEU mitigation, ECC |
| Memory Interfaces | — | DDR3/DDR4 with hard PHY (HPS + FPGA) |
| Lead-Free | — | Yes |