10AX090N3F40E2LG vs 10AX090N3F40I2SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090N3F40E2LG sa pamamagitan ng Intel at 10AX090N3F40I2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090N3F40E2LG | 10AX090N3F40I2SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 59,234,304 bits | — |
| DSP Blocks | 1,518 | [DATA_NEEDED: DSP block count] |
| User I/O Pins | 600 | — |
| Transceivers | Up to 24 full-duplex channels | [DATA_NEEDED: transceiver count and max data rate] |
| Transceiver Data Rate | Up to 14.4 Gbps | — |
| Hard Memory Controllers | Yes (DDR4, DDR3, QDR IV, RLDRAM 3) | — |
| Maximum DDR4 Rate | 2666 Mbps | — |
| PCIe Hard IP | PCIe Gen3 x8 (root port or endpoint) | — |
| Packhaging | 1517-ball FCBGA, 40 mm | 1517-BBGA, FCBGA (F40) |
| Process Technology | TSMC 20nm | 20 nm |
| Temperature na Operasyon | -40C to +100C (extended industrial) | — |
| Core Voltage | 0.9 V typical | 0.9 V |
| Configuration Encryption | AES-256 bitstream encryption | — |
| Partial Reconfiguration | Supported | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 900,000 |
| Embedded Memory (bits) | — | 59,234,304 |
| Number of LABs/CLBs | — | 339,620 |
| Number of User I/Os | — | 600 |
| Speed Grade | — | N3 |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Uri ng Pagpapasok | — | Surface Mount |
| Level ng MSL | — | 3 (168 Hours) |
| Moisture Sensitivity | — | MSL3 |
| Packaging | — | Tray |