10AX090R2F40E2SG vs 10AX090R2F40E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090R2F40E2SG sa pamamagitan ng Intel at 10AX090R2F40E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090R2F40E2SG | 10AX090R2F40E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | 10AX090 |
| Logic Elements | 900000 | — |
| LABs/CLBs | 339620 | — |
| Total RAM Bits | 59234304 | — |
| User I/O Count | 342 | 342 |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Code | F40 (approx. 40mm FCBGA) | — |
| Speed Grade | 2 (R2 -2 transceiver rating) | -E2 (Extended, mid-tier) |
| Temperature Grade | E2 (Extended: -40C to +100C junction) | — |
| Lead-Free / RoHS | Yes (SG suffix) | — |
| Transceivers | Up to 14.1 Gbps (Arria 10 GX feature) | 66 channels |
| DSP Blocks | Variable-precision, hardened floating-point capable | 18x19 multipliers |
| Process Node | TSMC 20nm | — |
| Uri ng Pagpapasok | Surface Mount (FCBGA ball grid) | Surface Mount (flip-chip BGA) |
| Level ng MSL | 3 (168 Hours) | 3 |
| Packaging | Tray | — |
| Series | — | Arria 10 GX |
| Logic Elements (LE) | — | 900,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Process Technology | — | 20 nm |
| Core Voltage | — | 0.9 V |
| Transceiver Data Rate | — | Up to 12.5 Gbps (GX) |
| Embedded Memory | — | 25 Mbits (MLAB + block RAM, total) |
| Packhaging | — | 1517-ball FCBGA |
| Operating Temperature Grade | — | Extended (-E) |
| Tindminan RoHS | — | Compliant |
| Lead-Free | — | Yes |