10AX090S4F45I3SG vs 10AX090S2F45E2SG Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090S4F45I3SG sa pamamagitan ng Intel at 10AX090S2F45E2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
10AX090S4F45I3SG 10AX090S4F45I3SG - Arria 10 GX FPGA 900K LE, 1932-FCBGA

10AX090S4F45I3SG - Arria 10 GX FPGA 900K LE, 1932-FCBGA

10AX090S4F45I3SG ✓ Nakahanda
Intel
10AX090S2F45E2SG 10AX090S2F45E2SG - Arria 10 GX FPGA 900K LE | Intel FPGA

10AX090S2F45E2SG - Arria 10 GX FPGA 900K LE | Intel FPGA

10AX090S2F45E2SG ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro 10AX090S4F45I3SG 10AX090S2F45E2SG
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Arria 10 GX Arria 10
Logic Elements 900,000 900,000
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory (bits) 59,234,304 59,234,304
Maximum User I/O 624 —
Transceivers [DATA_NEEDED: transceiver count and speed grade] [DATA_NEEDED: number of transceiver channels]
Process Technology TSMC 20nm Tri-Gate —
Hard Processor System (HPS) Integrated (dual-core ARM Cortex-A9 MPCore) —
Memory Controllers Hardened DDR4/DDR3/QDR-IV controllers —
Packhaging 1932-ball FCBGA, F45 (45mm) —
Speed Grade -3 (commercial fast / industrial fast) -2 (mid)
Temperature Grade Industrial (-40C to +100C junction) —
Configuration Active serial (AS) / passive serial (PS) / JTAG —
Uri ng Pagpapasok Surface Mount (HDI required) Surface Mount
Tindminan RoHS Compliant Compliant
REACH Status Compliant —
Lead-Free Yes Yes
Wala sa Halogen Yes —
Level ng MSL [DATA_NEEDED: MSL rating] [DATA_NEEDED: moisture sensitivity level]
Design Tool Intel Quartus Prime —
Series — Arria 10 GX
User I/O Count — 624
Logic Blocks — [DATA_NEEDED: ALM count]
DSP Blocks — [DATA_NEEDED: variable-precision DSP count]
Package Type — 1932-BBGA, FCBGA
Temperature na Operasyon — -40C to +100C (E2 = extended)
Process Node — 20nm TSMC
Device Variant — GX (transceiver-equipped)
Ball Count — 1932

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