10AX115H3F34E2LG vs 10AX115H3F34I2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115H3F34E2LG sa pamamagitan ng Intel at 10AX115H3F34I2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115H3F34E2LG - Arria 10 GX FPGA, 1.15M LE, 1152-FCBGA | Intel
10AX115H3F34E2LG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115H3F34E2LG | 10AX115H3F34I2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Series | 10AX115 | — |
| Logic Elements (LE) | 1,150,000 | — |
| Embedded Memory | 68,857,856 bits (67.7 Mbit) | 68,857,856 bits |
| User I/O Count | 504 | 504 |
| Transceivers | Up to 17.4 Gbps (per Arria 10 datasheet) | — |
| Hard IP | PCIe Gen3 x8, 10/25/100G Ethernet MAC, DDR4 controller | — |
| DSP Blocks | Variable-precision DSP (per Arria 10 datasheet) | Variable-precision, floating-point capable |
| Process Technology | 20 nm TSMC | — |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | E2 (commercial, mid-speed) | H3 |
| Packhaging | 1152-ball FCBGA (F34), 1.0 mm pitch | 1152-ball FCBGA |
| Temperature na Operasyon | 0C to +100C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount (BGA, reflow) | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | MSL3 (per JEDEC J-STD-020) | — |
| Logic Elements (LEs) | — | 1,150,000 |
| Transceiver Count | — | 24 |
| Maximum Transceiver Data Rate | — | 17.4 Gbps |
| DSP Performance | — | Up to 1.5 TFLOP/s (FP) |
| Hardened Memory Controllers | — | DDR4/DDR3/LPDDR3 |
| Hardened PCIe | — | PCIe Gen3 x8 |
| Hardened Ethernet MAC | — | 10G/40G/100G capable |
| Process Node | — | 20 nm |
| Temperature Grade | — | Industrial (-40C to +100C junction) |