10M16DAU324I7P vs 10M08DAU324I7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M16DAU324I7P sa pamamagitan ng Intel at 10M08DAU324I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M16DAU324I7P | 10M08DAU324I7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | — |
| Logic Elements | 16000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| User I/O Count | 246 | — |
| Embedded Memory | 549 kbit | — |
| Embedded Multipliers (18x18) | 246 | — |
| User Flash Memory | [DATA_NEEDED: user flash size] | 387,072 bits |
| Packhaging | 324-LFBGA (UBGA-324) | 324-LFBGA (UBGA), 1.0 mm pitch |
| Operating Supply Voltage (Core) | 1.2 V | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +100 C | — |
| Speed Grade | 7 | — |
| Temperature Grade | Industrial (I) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | MAX 10 |
| Logic Elements (LE) | — | 8,000 |
| Embedded Memory (M9K blocks) | — | 378 Kbits |
| Maximum User I/O | — | 246 |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Supply Voltage (Core) | — | 1.2 V typical |
| Supply Voltage (I/O Banks) | — | 1.2 V to 3.3 V |
| Process Technology | — | TSMC 55 nm embedded flash |
| DSP Blocks (18x18 Multipliers) | — | 24 |
| PLLs | — | 4 |
| On-chip ADC | — | Dual 12-bit, 1 MSPS |
| Configuration | — | Internal flash, JTAG, Passive Serial |
| Level ng MSL | — | 3 |