10M25DAF256C8G vs 10M04DAF256C7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M25DAF256C8G sa pamamagitan ng Intel at 10M04DAF256C7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M25DAF256C8G | 10M04DAF256C7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements (LE) | 25,000 | 4,000 |
| Embedded Memory | 1,728 Kbits | — |
| Embedded 18x18 Multipliers | 55 | — |
| User I/O Count | 178 | — |
| PLLs | 4 | — |
| Hard ADC Blocks | 2 (12-bit) | — |
| Configuration Flash | Internal, non-volatile | — |
| Process Node | 55 nm TSMC | — |
| Packhaging | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-LBGA (F256) FineLine BGA, 17 mm x 17 mm |
| Speed Grade | C8 | — |
| Temperature Grade | Commercial (0 °C to 85 °C) | — |
| Core Voltage | [DATA_NEEDED: core voltage] | 1.2 V |
| I/O Bank Voltage Range | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Level ng MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Maximum User I/Os | — | 178 |
| Embedded Memory (M9K blocks total) | — | 176 Kbits |
| User Flash Memory | — | 193,536 bits |
| Configuration Flash (on-die) | — | 1,178 Kbits (CFM0 + CFM1 dual-config) |
| Temperature Grade (junction) | — | 0C to 100C (commercial) |
| Auxiliary Voltage | — | 2.5 V / 3.3 V |
| ADC | — | 1 x 12-bit, 1 Msps SAR |
| PLL | — | 1 (general-purpose) |
| Process Technology | — | 55 nm TSMC flash-based |
| LVDS Transmitter (max data rate) | — | 800 Mbps |
| Lead-Free | — | Yes |