10M25DAF256C8G vs 10M50DAF256C8G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M25DAF256C8G sa pamamagitan ng Intel at 10M50DAF256C8G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M25DAF256C8G | 10M50DAF256C8G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | — |
| Embedded Memory | 1,728 Kbits | — |
| Embedded 18x18 Multipliers | 55 | — |
| User I/O Count | 178 | — |
| PLLs | 4 | 4 |
| Hard ADC Blocks | 2 (12-bit) | — |
| Configuration Flash | Internal, non-volatile | — |
| Process Node | 55 nm TSMC | — |
| Packhaging | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-ball FBGA (F256) |
| Speed Grade | C8 | C8 (8 ns) |
| Temperature Grade | Commercial (0 °C to 85 °C) | Commercial (0C to +85C) |
| Core Voltage | [DATA_NEEDED: core voltage] | 1.2 V |
| I/O Bank Voltage Range | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Level ng MSL | [DATA_NEEDED: MSL level] | 3 (per JEDEC J-STD-20) |
| Logic Elements | — | 49,760 (50K) |
| Embedded Memory (bits) | — | 1,677,312 |
| User Flash (bits) | — | 1,677,312 |
| Maximum User I/Os | — | 178 |
| Multipliers (18x18) | — | 312 |
| Global Clock Networks | — | 20 |
| On-chip ADC | — | 12-bit, 1 MSPS, single or dual supply |
| Process Technology | — | 55 nm |
| Configuration | — | Internal flash (non-volatile, instant-on) |