10M25DAF484I7G vs 10M25DCF484I7G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10M25DAF484I7G sa pamamagitan ng Intel at 10M25DCF484I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
10M25DAF484I7G 10M25DAF484I7G - MAX 10 FPGA 25K LE 484-FBGA | Intel

10M25DAF484I7G - MAX 10 FPGA 25K LE 484-FBGA | Intel

10M25DAF484I7G ✓ Nakahanda
Intel
10M25DCF484I7G 10M25DCF484I7G - MAX 10 FPGA 25K LE 484-BGA | Intel

10M25DCF484I7G - MAX 10 FPGA 25K LE 484-BGA | Intel

10M25DCF484I7G ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro 10M25DAF484I7G 10M25DCF484I7G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family MAX 10 MAX 10
Logic Elements (LE) 25,000 —
Embedded Memory (bits) 691,200 —
User I/Os 360 —
Packhaging 484-FBGA (FBGA) 484-ball FineLine BGA (F484)
Core Voltage 1.2 V —
Speed Grade I7 —
Temperature Grade Industrial (-40 C to +100 C ambient) Industrial (-40C to +100C), I7 suffix
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Tray / Reel Tray —
18 x 18 Multipliers 66 —
PLLs 2 Up to 4
On-chip Configuration Flash Dual (instant-on, dual-boot) —
Integrated ADC 12-bit SAR, up to 17 analog inputs —
Tindminan RoHS Compliant Compliant
Logic Elements — 25,000
Embedded Memory — 1,728 Kbits (M9K blocks)
User I/O Pins — 360
Ball Pitch — 1.0 mm
Volte ng Pagbibigay — 1.2 V core
Configuration Memory — 5 Mb on-chip flash
Process Technology — 55 nm TSMC
Multiplier Blocks — [DATA_NEEDED: 18x18 multiplier count]
Temperature na Operasyon — -40C to +100C

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita