10M25DAF484I7G vs 10M25DCF484I7G 比較

詳細並排比較 10M25DAF484I7G 由 Intel 與 10M25DCF484I7G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
10M25DAF484I7G 10M25DAF484I7G - MAX 10 FPGA 25K LE 484-FBGA | Intel

10M25DAF484I7G - MAX 10 FPGA 25K LE 484-FBGA | Intel

10M25DAF484I7G ✓ 啟用中
Intel
10M25DCF484I7G 10M25DCF484I7G - MAX 10 FPGA 25K LE 484-BGA | Intel

10M25DCF484I7G - MAX 10 FPGA 25K LE 484-BGA | Intel

10M25DCF484I7G ✓ 啟用中

規格比較

參數 10M25DAF484I7G 10M25DCF484I7G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family MAX 10 MAX 10
Logic Elements (LE) 25,000 —
Embedded Memory (bits) 691,200 —
User I/Os 360 —
封裝 484-FBGA (FBGA) 484-ball FineLine BGA (F484)
Core Voltage 1.2 V —
Speed Grade I7 —
Temperature Grade Industrial (-40 C to +100 C ambient) Industrial (-40C to +100C), I7 suffix
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
Tray / Reel Tray —
18 x 18 Multipliers 66 —
PLLs 2 Up to 4
On-chip Configuration Flash Dual (instant-on, dual-boot) —
Integrated ADC 12-bit SAR, up to 17 analog inputs —
RoHS 狀態 Compliant Compliant
Logic Elements — 25,000
Embedded Memory — 1,728 Kbits (M9K blocks)
User I/O Pins — 360
Ball Pitch — 1.0 mm
供應電壓 — 1.2 V core
Configuration Memory — 5 Mb on-chip flash
Process Technology — 55 nm TSMC
Multiplier Blocks — [DATA_NEEDED: 18x18 multiplier count]
工作溫度 — -40C to +100C

資料表與資源

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