5CGXBC5C7F27C8N vs 5CEFA9F27C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CGXBC5C7F27C8N sa pamamagitan ng Intel at 5CEFA9F27C7N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 5CGXBC5C7F27C8N | 5CEFA9F27C7N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone® V GX | Cyclone V E |
| Logic Elements (LE) | 77,000 | — |
| Adaptive Logic Modules (ALM) | 29,080 | — |
| Total Embedded Memory | 5,001,216 bits (4,884 Kbits usable) | — |
| Embedded Memory Blocks (M10K + MLAB) | 446 × M10K + 231 × MLAB (approx.) | — |
| 18 × 18 Multipliers | 364 | — |
| PLLs | 6 | — |
| Global Clock Networks | 16 | — |
| Transceivers | 6 × 3.125 Gbps (GX) | — |
| PCIe Hard IP | Yes (Gen1/Gen2) | — |
| Maximum User I/O | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.1 V | — |
| Process Node | 28 nm TSMC low-power | — |
| Packhaging | 672-pin FBGA (F27, 27 mm × 27 mm) | 672-ball FBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Temperature na Operasyon | 0 °C to +85 °C (commercial, C8) | 0C to +85C (commercial) |
| Configuration | JTAG (IEEE 1149.1) + Active Serial | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 301,000 |
| Embedded Memory | — | 14,251,008 bits (14.25 Mbit) |
| User I/O Pins | — | 336 |
| Supply Voltage (Core) | — | 1.13 V |
| Maximum Operating Frequency | — | 800 MHz |
| Package Body Size | — | 27 mm (F27) |
| Speed Grade | — | C7 (commercial) |
| Packaging | — | Tray (40 units per tray) |
| Lead-Free | — | Yes |
| Process Technology | — | 28 nm TSMC low-power |