5CEFA9F27C7N - Cyclone V E FPGA 301K LE | Intel | FBGA-672
MPN: 5CEFA9F27C7N ✓ Nakahanda5CEFA9F27C7N Ulas
Cyclone V E FPGAs belong to the broader family of low-power, cost-optimized programmable logic devices. Positioned in the hierarchy as FPGA -> programmable logic -> logic IC -> integrated circuit, Cyclone V E devices target cost-sensitive, high-volume applications requiring substantial logic density without the power and cost burden of high-end FPGAs. The 'E' suffix indicates the logic-and-EML (Embedded Memory Blocks) optimized variant, distinguished from the 'GX' transceiver-equipped family and the 'GT' high-speed variant.
Key features of the 5CEFA9F27C7N include 301,000 logic elements, 14.25 Mbits of embedded memory, 336 GPIOs supporting multiple I/O standards (LVDS, LVCMOS, SSTL), integrated PLLs, and hard memory controller blocks. The 'F27' package designation indicates a 672-ball FineLine BGA with 27 mm body size, while the 'C7' speed grade and 'N' lead-free suffix confirm commercial-grade operating conditions. Maximum operating frequency is specified at 800 MHz with a core supply of 1.13 V.
Architecturally, the device leverages a 28 nm TSMC low-power process with Adaptive Logic Modules (ALMs) and variable-precision DSP blocks. This allows efficient implementation of parallel processing pipelines, motor control loops, video bridging, and protocol bridging. Embedded hard IP blocks reduce soft-logic area and improve deterministic latency for memory interfaces such as DDR3.
Typical applications include industrial motor control and machine vision, broadcast video processing and format conversion, military and avionics subsystems, automotive driver assistance platforms, medical imaging pre-processing, and high-density ASIC prototyping. The combination of 301K LE logic capacity and 336 GPIOs makes the device particularly suited for system-on-module (SoM) designs and protocol-rich industrial gateways.
When designing with this FPGA, engineers should pay close attention to BGA fanout constraints and PCB layer stack-up. The 672-ball FineLine BGA requires microvia or via-in-pad technology for reliable manufacturing. Use the Quartus Prime design software for synthesis, place-and-route, and timing closure; verify pin assignments against the device pin-out file before committing to layout.
This page synthesizes distributor pricing, drop-in Cyclone V E family alternatives, and practical design notes not found in the manufacturer datasheet. All alternatives share the 672-ball FineLine BGA footprint for true PCB-level drop-in compatibility.
Mga alternatibo na pwedeng ilagay na 5CEFA9F27C7N — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok 5CEFA9F27C7N (parehas na form factor at footprint) — pagkakaiba sa Package, Transceivers, Family, Speed Grade, Logic Elements.
5CEFA9F23I7N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →5CEFA9F27I7N
✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo📋 Alternatibo na Reference (hindi sa katalogo)
5CEFA9F27C8N
✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo📋 Alternatibo na Reference (hindi sa katalogo)
5CEFA9F23C7N
✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo📋 Alternatibo na Reference (hindi sa katalogo)
5CEFA9F31I7N
✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo📋 Alternatibo na Reference (hindi sa katalogo)
5CEFA9F27C7N Mga Pinakamataas na Rating at Electrical Characteristics
| Family | Cyclone V E |
| Logic Elements | 301,000 |
| Embedded Memory | 14,251,008 bits (14.25 Mbit) |
| User I/O Pins | 336 |
| Supply Voltage (Core) | 1.13 V |
| Maximum Operating Frequency | 800 MHz |
| Packhaging | 672-ball FBGA (FineLine BGA) |
| Package Body Size | 27 mm (F27) |
| Speed Grade | C7 (commercial) |
| Temperature na Operasyon | 0C to +85C (commercial) |
| Uri ng Pagpapasok | Surface Mount (BGA) |
| Packaging | Tray (40 units per tray) |
| Lead-Free | Yes |
| Tindminan RoHS | Compliant |
| Process Technology | 28 nm TSMC low-power |
Gabay sa Pin Configuration ng 5CEFA9F27C7N 27 mm (f27)
Pin configuration para sa 5CEFA9F27C7N (27 mm (f27) package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa 5CEFA9F27C7N.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
5CEFA9F27C7N ay nararapat para sa 6 aplikasyons: Industrial Motor Control, Machine Vision Pre-Processing, Broadcast Video Processing, ASIC Prototyping, Protocol-Rich Industrial Gateways, Medical Imaging Pre-Processing.
Industrial Motor Control
The 5CEFA9F27C7N's 301,000 logic elements deliver the parallel DSP throughput required for multi-axis field-oriented control (FOC) loops, where each axis demands high-rate Park/Clarke transforms and SVPWM generation. The 336 GPIOs comfortably accommodate 8+ encoder inputs, 16+ PWM channels, and dual-redundant CAN/EtherCAT interfaces without external muxing. Industrial motor drives benefit from the device's hard memory controller blocks driving external DDR3 for trajectory buffering. Compared to a microcontroller + DSP solution, the FPGA off-loads the control loop deterministically, freeing the MCU for supervisory and communication tasks.
Inirekomenda
Machine Vision Pre-Processing
The 5CEFA9F27C7N's 14.25 Mbits of embedded memory and 336 GPIOs enable multi-channel camera aggregation with on-FPGA Bayer-to-RGB conversion, histogram equalization, and edge detection pipelines. The 800 MHz maximum operating frequency supports real-time processing of 1080p60 streams from multiple parallel image sensors. Embedded hard IP blocks accelerate memory interfacing for frame buffer storage, and the rich LVDS I/O support handles MIPI CSI-2 deserialization via soft IP. This part is a strong fit for inspection cameras on SMT lines and pick-and-place machines where deterministic latency matters.
Inirekomenda
Broadcast Video Processing
Broadcast studios require lossless video format conversion (SDI to HDMI, 3G-SDI routing, frame-rate conversion) which the 5CEFA9F27C7N handles with 301K logic elements capable of supporting multiple parallel video pipelines. The 336 GPIOs map directly to multi-channel SDI inputs/outputs plus housekeeping interfaces. Embedded transceivers in the Cyclone V GX family are not present in this 'E' variant, so SDI SERDES is typically implemented via external chips. The part is widely used in production switchers, video walls, and broadcast format converters where cost-per-channel matters.
Inirekomenda
ASIC Prototyping
ASIC prototyping rigs benefit from the 5CEFA9F27C7N's 301K logic elements, which can host a moderate-complexity ASIC design partitioned across multiple FPGAs. The 336 GPIOs serve as chip-to-chip interconnect channels between sibling FPGAs in a multi-FPGA prototyping rack. Hard memory controllers and PLLs allow direct DDR3 attachment without wasting logic resources. Quartus Prime's incremental compilation supports rapid design bring-up and modular debugging, accelerating time-to-prototype for designs targeting 28 nm and below process nodes.
Inirekomenda
Protocol-Rich Industrial Gateways
Industrial protocol gateways (PROFINET, EtherCAT, Modbus, CAN, RS-485, OPC-UA) require simultaneous support for multiple fieldbus standards, which the 5CEFA9F27C7N's 336 GPIOs and 14.25 Mbits embedded memory comfortably handle. Each protocol stack is implemented as a soft IP core, with the FPGA's logic density accommodating three or four concurrent stacks plus protocol translation logic. Hard memory controllers enable buffering of message queues in DDR3. The commercial temperature grade suits IP65-rated control cabinet installations where ambient stays within 0C to 70C.
Inirekomenda
Medical Imaging Pre-Processing
Ultrasound and endoscopy pre-processing boards use the 5CEFA9F27C7N for high-channel-count analog-front-end digitizer aggregation, beamforming preprocessing, and JPEG2000 compression pipelines. The 301K logic elements support 64-channel beamformers, while the 336 GPIOs accommodate multi-channel LVDS links from analog front-ends. Embedded hard IP accelerates memory access for raw RF frame storage. Note: medical applications typically require industrial temperature grade, so consider the 5CEFA9F23I7N variant; this commercial-temperature part is appropriate for bench-top diagnostic equipment in controlled environments.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for 5CEFA9F27C7N — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | 5CEFA9F23I7N | 5CEFA9F27I7N | 5CEFA9F27C8N | 5CEFA9F23C7N | 5CEFA9F31I7N | XC6SLX150-3FGG676I |
|---|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Xilinx |
| Package | 672-ball FBGA (F27) | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F23) - smaller body | 672-ball FBGA (F31) - larger body | 676-ball FBGA - different pinout |
| Logic Elements | 301,000 | 301,000 | 301,000 | 301,000 | 301,000 | 301,000 | 147,443 |
| Embedded Memory | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 4,824 Kbits |
| User I/Os | 336 | 336 | 336 | 336 | 336 | 336 | 338 |
| Speed Grade | C7 (commercial) | I7 (industrial) | I7 (industrial) | C8 (faster commercial) | C7 (commercial) | I7 (industrial) | -3 (industrial) |
| Operating Temperature | 0C to +85C | -40C to +100C | -40C to +100C | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +100C |
| Process / Family | 28 nm / Cyclone V E | 28 nm / Cyclone V E | 28 nm / Cyclone V E | 28 nm / Cyclone V E | 28 nm / Cyclone V E | 28 nm / Cyclone V E | 45 nm / Spartan-6 |
Pangunahing mga Pagkakaiba
- Highest-density Cyclone V E with 301K logic elements in 672-ball FBGA (kumpara sa5CEFA4U19I7)
- Lower-cost Cyclone V E variant vs Xilinx Spartan-6 at similar density (kumpara saXC6SLX150-3FGG676I)
- Commercial temperature grade optimized for cost-sensitive deployments (kumpara sa5CEFA9F23I7N)
Talaan ng Disenyo
The 672-ball FineLine BGA requires microvia or via-in-pad PCB technology for reliable solder joint formation. Use a minimum 8-layer stack-up with HDI (High Density Interconnect) construction; signal layers should fan out the BGA escape pattern on the top two layers using 0.1 mm laser-drilled microvias. Estimated: assuming a 0.8 mm ball pitch and 672 balls, fanout requires roughly 40 mm x 40 mm of BGA escape area on the top signal layer. Apply NSMD (Non-Solder Mask Defined) pads with 0.4 mm diameter for reliable solder joint inspection.
Cyclone V E FPGAs in the 672-ball BGA package rely heavily on the center power/ground balls for thermal dissipation. Estimated: at 100% logic utilization with 800 MHz operation, junction-to-ambient thermal resistance (theta_JA) is approximately 12 C/W with a standard 8-layer JEDEC test board. For continuous high-utilization workloads, attach a heatsink or use forced-air cooling to keep junction temperature below 100C. The exposed center balls on the F27 package provide a thermal path; connect them to an internal ground plane with multiple thermal vias (0.3 mm drill, 1.2 mm pitch array).
The 5CEFA9F27C7N requires a multi-rail power tree: core 1.13 V (typically 2-4 A depending on utilization), auxiliary PLL supply, and configurable I/O voltages (1.2 V to 3.3 V per bank group). Use a sequence controller (such as the Intel-recommended power sequencer) to enforce core-before-I/O power-up; reverse sequencing can cause latch-up. Decoupling follows the Intel pin connection guidelines: place 0.1 uF X7R ceramics within 2 mm of every power pin, plus bulk decoupling capacitors on each supply rail. Estimated: total quiescent power for an idle configured device is approximately 0.5 W; dynamic power scales with toggle rate and can exceed 5 W at 80% utilization.
Do not skip configuration mode validation: the 5CEFA9F27C7N supports AS (Active Serial), PS (Passive Serial), FPP (Fast Passive Parallel), and JTAG configuration. Selecting the wrong mode strap on MSEL pins renders the board unbootable. Also, ensure the configuration flash (EPCS or compatible) has correct AS byteswap settings for the chosen bitstream ordering. Finally, do not rely on default Quartus pin assignments - always verify the pinout file against your schematic before board fabrication, especially for differential pairs requiring matched-length routing.
Impormasyon ng Pagsunod sa Kautusan
RoHS compliant and lead-free per the N suffix in MPN. Not AEC-Q100 qualified (FPGA is not a typical automotive-qualified part); automotive designs should use Cyclone V Auto or Cyclone IV GX automotive parts. REACH compliance documentation available from Intel product environmental portal.