5CGXBC7C7F23C8N vs 5CGXBC5C7F27C8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 5CGXBC7C7F23C8N sa pamamagitan ng Intel at 5CGXBC5C7F27C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 5CGXBC7C7F23C8N 5CGXBC5C7F27C8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series Cyclone V GX —
Family 5CGXC7 (logic density tier) Cyclone® V GX
Logic Elements (LE) 149,500 77,000
Embedded Memory Bits 7,880,704 bits (~963 Kbytes) —
Embedded 18x18 Multipliers 312 —
Transceivers 6 channels, up to 3.125 Gbps 6 × 3.125 Gbps (GX)
User I/O Pins 240 —
Core Voltage 1.1 V 1.1 V
Process Technology TSMC 28 nm low-power —
Packhaging 484-ball FBGA (F23) 672-pin FBGA (F27, 27 mm × 27 mm)
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Temperature Grade Commercial (0C to 85C) —
Speed Grade 8 (slowest commercial) —
Hard Memory Controllers 2 —
PLLs Up to 8 6
Global Clock Networks Up to 16 16
Tindminan RoHS Compliant Compliant
Adaptive Logic Modules (ALM) — 29,080
Total Embedded Memory — 5,001,216 bits (4,884 Kbits usable)
Embedded Memory Blocks (M10K + MLAB) — 446 × M10K + 231 × MLAB (approx.)
18 × 18 Multipliers — 364
PCIe Hard IP — Yes (Gen1/Gen2)
Maximum User I/O — [DATA_NEEDED: maximum user I/O count]
Process Node — 28 nm TSMC low-power
Temperature na Operasyon — 0 °C to +85 °C (commercial, C8)
Configuration — JTAG (IEEE 1149.1) + Active Serial

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