5CGXBC9D6F27C7N vs 5CEFA9F27C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CGXBC9D6F27C7N sa pamamagitan ng Intel at 5CEFA9F27C7N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 5CGXBC9D6F27C7N | 5CEFA9F27C7N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V GX | Cyclone V E |
| Logic Elements | 301,000 | 301,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 14,251,008 bits | 14,251,008 bits (14.25 Mbit) |
| Memory Blocks (M20K) | [DATA_NEEDED: M20K count] | — |
| Embedded Multipliers (18x18) | 336 | — |
| Transceivers | GX family transceivers (per package variant) | — |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| PCIe Hard IP | Yes, Gen1/Gen2 | — |
| Core Voltage | 1.1 V | — |
| I/O Voltage Support | 1.2 V to 3.3 V (bank-dependent) | — |
| User I/O Pins | [DATA_NEEDED: user I/O count for FBGA-672] | 336 |
| Process Technology | 28 nm TSMC low-power | 28 nm TSMC low-power |
| Packhaging | 672-ball FBGA | 672-ball FBGA (FineLine BGA) |
| Speed/Grade | C7 (commercial, speed grade 7) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Tindminan RoHS | Compliant | Compliant |
| Supply Voltage (Core) | — | 1.13 V |
| Maximum Operating Frequency | — | 800 MHz |
| Package Body Size | — | 27 mm (F27) |
| Speed Grade | — | C7 (commercial) |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| Packaging | — | Tray (40 units per tray) |
| Lead-Free | — | Yes |