5CSEBA4U23A7N vs 5CSEBA4U23C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CSEBA4U23A7N sa pamamagitan ng Altera at 5CSEBA4U23C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
5CSEBA4U23C7N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 5CSEBA4U23A7N | 5CSEBA4U23C7N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEA4 | 5CSEA4 (Logic Element density) |
| Logic Elements | 40 K | 40,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 700 MHz | — |
| Packhaging | 672-pin UBGA (U23, 23x23 mm) | 672-ball UBGAs (UBGA), 23x23 mm |
| Process Node | 28 nm low power | — |
| DSP Blocks | Variable-precision DSP blocks (Cyclone V SE family feature) | — |
| Embedded Memory | M10K memory blocks (family feature) | Approximately 2.7 Mbits (M10K + M9K) |
| Speed Grade | 7 | — |
| Temperature na Operasyon | [DATA_NEEDED: industrial temp range explicit value] | Commercial 0C to +85C (C7 speed grade) |
| Family Maximum Logic Elements | Up to 301 K LE | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| HPS Peripherals | Gigabit Ethernet, USB 2.0, SATA, UART, SPI, I2C, CAN | — |
| FPGA-HPS Interface | ARM AMBA AXI coherence fabric | — |
| HPS Maximum Core Frequency | — | 800 MHz |
| DSP Blocks (18x18) | — | 224 |
| Core Voltage | — | 1.1 V |
| User I/O Count | — | 364 |
| High-Speed Transceivers | — | 6 (up to 3.125 Gbps) |
| PCIe Hard IP | — | 2 Gen2 blocks |
| Process Technology | — | TSMC 28 nm low-power |
| HPS Memory Interface | — | DDR3, DDR3L, LPDDR2 (16-bit + ECC option) |