5CSEBA4U23C8N vs 5CSEBA4U23C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CSEBA4U23C8N sa pamamagitan ng Intel at 5CSEBA4U23C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
5CSEBA4U23C8N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C8N ✓ NakahandaIntel
5CSEBA4U23C6N - Cyclone V SE SoC FPGA 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C6N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 5CSEBA4U23C8N | 5CSEBA4U23C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements (LE) | 40,000 | — |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum HPS Frequency | 600 MHz | — |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| DSP Blocks | [DATA_NEEDED: variable-precision DSP count] | — |
| Multipliers | 18x18 dedicated multipliers | — |
| Maximum User I/O | 188 | — |
| Packhaging | 672-pin UBGA (UBGA-672, 23x23 mm) | 672-pin UFBGA / UBGA, 23 x 23 mm, 0.8 mm pitch |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm low-power |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, CAN, UART, SPI, I2C, NAND, SDXC | — |
| Memory Controller (HPS) | DDR3/DDR3L/LPDDR2 with hard PHY | — |
| Temperature na Operasyon | [DATA_NEEDED: industrial Tj range] | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements | — | 40,000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (M10K + MLAB) | — | 2,460 Kbits |
| DSP Blocks (18x18 Multipliers) | — | 112 |
| HPS Processor Cores | — | Dual ARM Cortex-A9 MPCore |
| HPS Maximum CPU Clock | — | 925 MHz |
| Hard Memory Controller | — | DDR3 / DDR3L / LPDDR2 |
| Core Voltage (VCC) | — | 1.1 V |
| General-Purpose FPGA I/Os | — | 188 |
| Transceivers | — | Not integrated on SE device |
| Temperature ng Junction na Operasyon | — | -40 C to +100 C (typical SE spec; exact C6 grade per datasheet) |
| Configuration Modes | — | JTAG (IEEE 1149.1), Active Serial (AS) via EPCS/EPCQ |