5CSEBA6U23I7LN vs 5CSEBA6U19I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CSEBA6U23I7LN sa pamamagitan ng Intel at 5CSEBA6U19I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
5CSEBA6U19I7N - Cyclone V SE SoC FPGA, 110K LE, Dual ARM Cortex-A9 800MHz | Intel
5CSEBA6U19I7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 5CSEBA6U23I7LN | 5CSEBA6U19I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements | 110,000 | 110,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum CPU Clock | 925 MHz | — |
| Packhaging | 672-pin UBGA (UBG-672) 23x23 mm | 484-pin UBGAFBGA (UBGA-484, 19x19 mm) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Speed Grade | I7 (fast) | — |
| Temperature Range | Industrial (-40C to +100C junction) | — |
| Suffix L | Lead-free | — |
| Suffix N | Tray packaging | — |
| Tindminan RoHS | Compliant (lead-free suffix) | Compliant |
| Hard Memory Blocks | [DATA_NEEDED: total M10K and MLAB bits] | — |
| DSP Blocks | [DATA_NEEDED: variable-precision DSP block count] | 112 (18x18 multipliers) |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART, SD/SDIO | — |
| Configuration Mode | JTAG and Active Serial (AS) | — |
| Process Node | TSMC 28 nm low-power | — |
| Design Toolchain | Intel Quartus Prime + SoC EDS | — |
| Series | — | 5CSEBA6 |
| Device Variant | — | 5CSEA6 (U19 package, 110K LE) |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore |
| HPS Maximum Frequency | — | 800 MHz |
| Embedded Memory | — | 4.45 Mbits (M10K + MLAB) |
| Hard Memory Controller | — | DDR3, DDR3L, LPDDR2 |
| Transceivers | — | Up to 9 channels, 3.125 Gbps |
| PLLs | — | 6 (FPGA) + 3 (HPS) |
| User I/O Banks | — | 8 |
| Maximum User I/O | — | 288 (package-dependent) |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Process Technology | — | TSMC 28 nm low-power |
| Volte ng Pagbibigay | — | Multi-rail (1.1 V core, 1.5/1.8/2.5/3.0/3.3 V I/O) |
| Configuration Modes | — | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |