A3P600-FG256 vs A3P600-FGG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P600-FG256 sa pamamagitan ng Microchip Technology at A3P600-FGG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip
A3P600-FG256 ✓ NakahandaMicrochip Technology
A3P600-FGG256I - ProASIC3 Flash FPGA 600K Gates | Microchip
A3P600-FGG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3P600-FG256 | A3P600-FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3 (Flash FPGAs) | ProASIC3 |
| System Gates | 600000 | 600K |
| Logic Elements | 7K LEs (VersaTiles) | — |
| Embedded SRAM | 110592 bits (True Dual-Port) | — |
| User I/O | 177 | 177 |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.5 V |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm |
| Maximum System Performance | Approx. 231 MHz | — |
| Configuration Technology | On-chip flash, reprogrammable, single-chip | Flash (nonvolatile, single-chip) |
| Power-Up Behavior | Instant On Level 0 support | — |
| Packhaging | 256-LBGA / FBGA (17x17 mm, 1 mm pitch) | 256-Ball FBGA (FGG256) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0 C to 85 C (TJ) | -40C to +85C |
| I/O Banks | 4 (independent VCCIBx supplies) | 4 |
| Packaging | Tray | — |
| Tindminan RoHS | RoHS non-compliant (per Microchip USA listing) | Compliant |
| Manufacturer Lead Time | 8 weeks | — |
| Logic Elements (D-Registers) | — | 13824 |
| Embedded RAM | — | 110592 bits |
| Maximum System Frequency | — | 231 MHz |
| Lead-Free | — | Yes |
| Typical Applications | — | Signal processing, industrial automation, communications, hardware acceleration |