A3P600-FGG484I vs A3P600-FG484 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng A3P600-FGG484I sa pamamagitan ng Microchip Technology at A3P600-FG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
A3P600-FGG484I A3P600-FGG484I - 600K Gate Flash FPGA, 231MHz | Microchip

A3P600-FGG484I - 600K Gate Flash FPGA, 231MHz | Microchip

A3P600-FGG484I ✓ Nakahanda
Microchip Technology
A3P600-FG484 A3P600-FG484 - ProASIC3 600K-Gate Flash FPGA, 484-BGA | Microchip

A3P600-FG484 - ProASIC3 600K-Gate Flash FPGA, 484-BGA | Microchip

A3P600-FG484 ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro A3P600-FGG484I A3P600-FG484
Brand Microchip Technology Microchip Technology
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Presyo ng Yunit (USD) $55.30 —
FPGA Family ProASIC3 —
System Gates 600000 —
Number of User I/O 235 —
Embedded SRAM 13.5 kB —
System Performance 231 MHz 231 MHz
Process Technology 130 nm 130 nm, 7-layer metal flash
Core Supply Voltage 1.5 V 1.425 V to 1.575 V
Package Type 484-FBGA —
Uri ng Pagpapasok Surface Mount Surface Mount
Operating Temperature Grade Industrial (I suffix) —
Lead-Free Finish Yes (LEAD FREE per Mouser listing) —
Configuration Flash-based, non-volatile, instant on —
Programming Interface JTAG —
Tindminan RoHS [DATA_NEEDED: RoHS compliance statement] RoHS3 Compliant (lead-free per FGG variant)
REACH Status [DATA_NEEDED: REACH compliance statement] —
AEC-Q100 Not applicable (FPGA) —
Tray Packaging Yes (per datasheets.com listing) —
Family — ProASIC3 (Flash FPGAs)
Total Gates — 600000 gates
Number of Registers — 13824
VersaTiles (Logic Elements) — 13824
Maximum User I/O — 235 I/O
Configuration Memory — On-chip flash (non-volatile, instant-on)
Embedded Memory — Embedded block SRAM (18 kbit blocks)
Soft Processor Support — ARM Cortex-M1 (optional soft core)
Packhaging — 484-pin FBGA, 23x23 mm
Temperature na Operasyon — 0C to +85C (TJ)
Packaging — Tray
Programming — In-system programmable via JTAG, no external boot device

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