A3P600-FGG484I vs A3P600-FGG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P600-FGG484I sa pamamagitan ng Microchip Technology at A3P600-FGG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P600-FGG484I - 600K Gate Flash FPGA, 231MHz | Microchip
A3P600-FGG484I ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | A3P600-FGG484I | A3P600-FGG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Presyo ng Yunit (USD) | $55.30 | — |
| FPGA Family | ProASIC3 | — |
| System Gates | 600000 | 600K |
| Number of User I/O | 235 | — |
| Embedded SRAM | 13.5 kB | — |
| System Performance | 231 MHz | — |
| Process Technology | 130 nm | 130 nm CMOS |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Package Type | 484-FBGA | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial (I suffix) | — |
| Lead-Free Finish | Yes (LEAD FREE per Mouser listing) | — |
| Configuration | Flash-based, non-volatile, instant on | — |
| Programming Interface | JTAG | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance statement] | Lead Free |
| REACH Status | [DATA_NEEDED: REACH compliance statement] | — |
| AEC-Q100 | Not applicable (FPGA) | — |
| Tray Packaging | Yes (per datasheets.com listing) | — |
| Family | — | ProASIC3 |
| Maximum System Frequency | — | 231 MHz |
| User I/O Count | — | 235 |
| Packhaging | — | 484-Pin FBGA (FGG484) |
| Configuration Memory | — | Flash-based (non-volatile, single chip) |
| Terminal Form | — | Ball |
| Package Shape | — | Square BGA |
| Temperature Grade | — | Commercial |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Operating Temperature Minimum | — | 0 C |
| Operating Temperature Maximum | — | [DATA_NEEDED: maximum operating temperature] |
| Number of Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM capacity] |