A3PE1500-1FG676I vs A3PE1500-2FGG676 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng A3PE1500-1FG676I sa pamamagitan ng Microchip Technology at A3PE1500-2FGG676 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
A3PE1500-1FG676I A3PE1500-1FG676I - ProASIC3E FPGA 1.5M Gates | Microchip

A3PE1500-1FG676I - ProASIC3E FPGA 1.5M Gates | Microchip

A3PE1500-1FG676I ✓ Nakahanda
Microchip Technology
A3PE1500-2FGG676 A3PE1500-2FGG676 - ProASIC3E FPGA 1.5M Gates | Microchip

A3PE1500-2FGG676 - ProASIC3E FPGA 1.5M Gates | Microchip

A3PE1500-2FGG676 ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro A3PE1500-1FG676I A3PE1500-2FGG676
Brand Microchip Technology Microchip Technology
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family ProASIC3E —
System Gates 1.5M 1,500,000
Logic Elements (CLBs) 38400 —
User I/Os 444 —
Total RAM Bits 276480 276,480
Max System Performance 272MHz —
Core Supply Voltage 1.5V 1.425 V to 1.575 V
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage range] —
Process Technology 130nm, 7-layer metal (6 copper), Flash-based CMOS 130 nm
Package Type FBGA-676 (27 x 27 mm, 1 mm pitch, 2.23 mm height) —
Uri ng Pagpapasok Surface Mount Surface Mount
Hanay ng Temperature na Operasyon 0°C to 70°C (per DigChip listing) —
Configuration Non-volatile Flash (single-chip, live at power-up) Flash-based, reprogrammable
Programming In-system programmable (ISP) via JTAG —
Total Power Consumption [DATA_NEEDED: total power consumption] —
Number of I/O Banks [DATA_NEEDED: I/O bank count] —
Tindminan RoHS RoHS non-compliant (per DigChip listing) RoHS Compliant
Lead-Free Status Contains lead (per DigChip listing) —
Product Family — ProASIC3E
Logic Elements — 16KLEs
User I/O — 444
Temperature na Operasyon — 0°C to 85°C (TJ)
Speed Grade — -2
System Performance — 310 MHz
Packhaging — 676-BGA (FBGA)
Terminal Pitch — 1.000 mm
I/O Standards — [DATA_NEEDED: supported I/O standards]
PLLs — [DATA_NEEDED: number of PLLs/CCs]
Security — AES-based design security
Packaging — Tray
Lead Free Status — Lead Free

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