A3PE1500-1FGG48C vs A3PE1500-1FGG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE1500-1FGG48C sa pamamagitan ng Microchip Technology at A3PE1500-1FGG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE1500-1FGG48C - ProASIC3E Flash FPGA 484-BGA | Microchip
A3PE1500-1FGG48C ✓ NakahandaMicrochip Technology
A3PE1500-1FGG484 - ProASIC3E Flash FPGA 1.5M Gates | Microchip
A3PE1500-1FGG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE1500-1FGG48C | A3PE1500-1FGG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3E Flash FPGA | ProASIC3E |
| System Gates | 1,000,000 | 1,500,000 (1.5M) |
| User I/O | 280 | — |
| Configuration Capacity | 276,480 bits | — |
| Speed Grade | -1 | -1 (standard) |
| Temperature Grade | C (Commercial) | — |
| Technology | Nonvolatile Flash | — |
| Reprogrammable | Yes | — |
| Soft ARM Support | Optional | — |
| Packhaging | 484-Ball FBGA (FGG484) | 484-ball FBGA (FGG484), 1.00 mm pitch |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Instant On | Yes (no external boot flash) | — |
| RoHS | Compliant (G suffix) | — |
| Package Footprint Compatibility | FG256 and FG484 footprint-compatible | — |
| VREF Requirement | One voltage-referenced I/O per minibank for voltage-referenced standards | — |
| Temperature na Operasyon | [DATA_NEEDED: Operating Temperature range] | 0C to +70C (commercial) |
| Core Supply Voltage | [DATA_NEEDED: Core Supply Voltage] | 1.5 V |
| Embedded SRAM | [DATA_NEEDED: Embedded SRAM capacity] | Up to 504 kbits true dual-port |
| Fabric Cells / Logic Capacity | — | 276,480 |
| Logic Cells | — | 38,400 |
| User I/Os (this package) | — | 280 |
| Max User I/Os (family) | — | 616 |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration Memory | — | On-chip flash (live-at-power-up, single-chip) |
| Packaging | — | Tray |
| Maksimum na Taktiko ng Oras | — | [DATA_NEEDED: maximum clock frequency] |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |