A3PE3000-1FGG324I vs A3PE3000-FGG324I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000-1FGG324I sa pamamagitan ng Microchip Technology at A3PE3000-FGG324I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000-1FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-1FGG324I ✓ NakahandaMicrochip Technology
A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FGG324I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000-1FGG324I | A3PE3000-FGG324I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3E (Flash-based FPGA) | ProASIC3E (ProASIC3E Flash Family) |
| System Gates | 3,000,000 | 3000000 gates |
| User I/Os (this package) | 221 | — |
| Max User I/Os (family) | 616 | — |
| Embedded SRAM | 504 kbits true dual-port | — |
| Supply Voltage (core) | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | — |
| Configuration | Flash-based, Live-at-Power-Up Level 0, single-chip | — |
| Soft CPU Support | Optional soft ARM support | — |
| Packhaging | 324-BGA FBGA (19x19 mm, 1 mm pitch) | 324-BGA (FBGA/PBGA324), 19 x 19 mm |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +100C (TJ) | -40 C to +125 C (Industrial, I grade) |
| Number of Gates | 3,000,000 | — |
| Speed Grade | -1 | — |
| Packaging | Tray | — |
| Tindminan RoHS | ROHS3 Compliant | [DATA_NEEDED: RoHS status] |
| Product Status | Active | — |
| Manufacturer Lead Time | 8 weeks | — |
| Logic Elements (CLBs) | — | 75264 |
| Total User I/O | — | 221 |
| Embedded Memory | — | 516096 bits |
| Maximum Frequency | — | 350 MHz |
| Core Supply Voltage | — | 1.5 V |
| Technology | — | 130 nm CMOS, nonvolatile flash |
| Ball Pitch | — | 1 mm |
| Package Height | — | 1.63 mm |
| Configuration Memory | — | Nonvolatile flash, reprogrammable, Instant-On |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL Level] |