A3PE3000-1FGG896 vs A3PE3000L-1FGG896 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000-1FGG896 sa pamamagitan ng Microchip Technology at A3PE3000L-1FGG896 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
A3PE3000-1FGG896 A3PE3000-1FGG896 - ProASIC3E Flash FPGA 3M Gates 620 I/O | Microchip

A3PE3000-1FGG896 - ProASIC3E Flash FPGA 3M Gates 620 I/O | Microchip

A3PE3000-1FGG896 ✓ Nakahanda
Microchip Technology
A3PE3000L-1FGG896 A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip

A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip

A3PE3000L-1FGG896 ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro A3PE3000-1FGG896 A3PE3000L-1FGG896
Brand Microchip Technology Microchip Technology
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family ProASIC3E (Flash FPGA) ProASIC3L
System Gates 3,000,000 3000000
Logic Cells 75,264 75264
User I/O 620 620
Speed Grade -1 -1
Packhaging 896-ball FBGA (FGG896) 896-ball FBGA (FGG896), 1.00 mm pitch
Technology Nonvolatile flash, CMOS —
Configuration Single-chip, Instant On (on-chip flash) —
Reprogrammability Yes (in-system reprogrammable flash fabric) —
Uri ng Pagpapasok Surface Mount Surface Mount
Core Voltage [DATA_NEEDED: core voltage] 1.2 V (supports 1.2 V to 1.5 V)
Temperature na Operasyon [DATA_NEEDED: operating temperature range] —
Embedded Memory [DATA_NEEDED: embedded block RAM capacity] —
Lead Free Yes (LEAD FREE per distributor listing) —
Tindminan RoHS Compliant —
Level ng MSL [DATA_NEEDED: moisture sensitivity level] —
Country of Origin South Korea (per MicrochipDirect for A3PE3000-1FG896 family variant) —
Total Bits of RAM — [DATA_NEEDED: Total embedded RAM bits]
I/O Voltage — As low as 1.2 V
Process Technology — 130 nm flash
Configuration Memory — Nonvolatile flash (single-chip)
Special Features — Flash*Freeze technology
Packaging — Tray
Terminal Pitch — 1.00 mm
Technology Base — CMOS flash
Dynamic Power Reduction vs ProASIC3 — Approx. 40%
Static Power Reduction vs ProASIC3 — Approx. 50%

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