A3PE3000-2FG896I vs A3PE3000L-FGG896M Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000-2FG896I sa pamamagitan ng Microchip Technology at A3PE3000L-FGG896M sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000-2FG896I - ProASIC3E FPGA 3M Gates 620 I/O | Microchip
A3PE3000-2FG896I ✓ NakahandaMicrochip Technology
A3PE3000L-FGG896M - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-FGG896M ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000-2FG896I | A3PE3000L-FGG896M |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3E Flash FPGA | ProASIC3L (Flash-based FPGA) |
| System Gates | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | 75,264 |
| Total RAM Bits | 516,096 | — |
| Number of I/Os | 620 | — |
| Supply Voltage (Core) | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Speed Grade | -2 | — |
| Process Technology | 130 nm flash | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Packhaging / Kaso | 896-BGA (FBGA-896, 31 x 31 mm, 1.0 mm pitch) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +85C ambient (+100C TJ) | 0 to 70 C |
| Configuration Memory | On-chip flash (nonvolatile, single-chip) | — |
| Packaging | Tray | — |
| Tindminan RoHS | Non-compliant (lead-bearing) | — |
| Manufacturer Lead Time | 8 weeks | — |
| Max System Frequency | 350 MHz (per third-party listing) | — |
| Product Status | Active | — |
| User I/Os | — | Up to 616 (620 per DigiKey listing) |
| Embedded SRAM | — | 504 kbits true dual-port |
| Core Voltage | — | 1.2 V to 1.5 V |
| Volte ng Pagbibigay | — | 1.5 V |
| Packhaging | — | 896-ball FBGA (FGG896), 1 mm pitch |
| Logic Family | — | CMOS |
| Configuration | — | Non-volatile flash, live-at-power-up Level 0, single-chip |
| Low-Power Feature | — | Flash*Freeze technology |
| Boundary Scan | — | IEEE 1149.1 (JTAG) |
| Input Features | — | Schmitt trigger option on single-ended inputs; weak pull-up/pull-down |