A3PE3000-FGG484 vs A3PE3000L-1FGG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000-FGG484 sa pamamagitan ng Microchip Technology at A3PE3000L-1FGG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000-FGG484 - ProASIC3E FPGA 3M Gates 484-BGA | Microchip
A3PE3000-FGG484 ✓ NakahandaMicrochip Technology
A3PE3000L-1FGG484 - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000-FGG484 | A3PE3000L-1FGG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3E | ProASIC3L |
| System Gates | 3000000 gates | 3,000,000 |
| Logic Cells | 75264 | 75,264 |
| User I/O | 341 | — |
| Total RAM Bits | 516096 | — |
| Maximum Operating Frequency | 231 MHz | — |
| Process Technology | 130 nm CMOS | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.5 V | — |
| Program Memory Type | Flash (non-volatile) | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Packhaging | 484-BGA (FBGA-484), 23 x 23 mm, 1 mm pitch, 2.23 mm height | 484-ball FBGA (FG484), 23 x 23 mm, 1 mm pitch |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | 0C to +70C |
| Speed Grade | [DATA_NEEDED: speed grade code] | -1 |
| Tindminan RoHS | RoHS Compliant (FGG lead-free variant) | [DATA_NEEDED: RoHS status] |
| Supplier Device Package | 484-FBGA | — |
| Programming Support | Microchip Libero SoC design suite | — |
| User I/Os (this package) | — | 341 |
| Maximum User I/Os (family) | — | 616 |
| Embedded SRAM | — | Up to 504 kbits true dual-port |
| Core Voltage | — | 1.2 V to 1.5 V |
| Supply Voltage (I/O) | — | 1.5 V (bank-dependent [DATA_NEEDED: exact I/O bank voltage range]) |
| Configuration | — | Nonvolatile flash, Instant On, single chip |
| Low Power Feature | — | Flash*Freeze technology |
| Style ng Pagpapasok | — | SMD/SMT |
| Packaging | — | Tray |
| Power-Up Mode | — | Live at power-up (Level 0 support) |