A3PE3000L-1FG484I vs A3PE3000L-FG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-1FG484I sa pamamagitan ng Microchip Technology at A3PE3000L-FG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip
A3PE3000L-1FG484I ✓ NakahandaMicrochip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-1FG484I | A3PE3000L-FG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3,000,000 gates | 3000000 |
| Logic Elements (LEs) | 35 KLEs | — |
| Total RAM Bits | 516096 bits | — |
| Number of I/O | 341 | — |
| Core Voltage | 1.2 V (family supports 1.2 V to 1.5 V) | — |
| Process Technology | 130 nm flash | — |
| Special Features | Flash*Freeze technology, non-volatile single-chip | — |
| Speed Grade | -1 | — |
| Packhaging | 484-ball FBGA (FG484) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Terminal Form | Ball (BGA, square) | — |
| Temperature Grade | Industrial (I) | — |
| Temperature na Operasyon | [DATA_NEEDED: exact min/max operating temperature range] | [DATA_NEEDED: Operating Temperature] |
| Supply Voltage - I/O | [DATA_NEEDED: I/O bank voltage range] | — |
| Configuration | On-chip flash, no external boot device | Flash-based, Instant On, single-chip |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance] |
| Packaging | Tray | — |
| Logic Cells / CLBs | — | 75264 |
| User I/Os | — | 341 |
| Maximum System Frequency | — | 250 MHz |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Technology | — | 130 nm CMOS flash, nonvolatile |
| Low Power Feature | — | Flash*Freeze technology |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 x 23 mm, 1 mm ball pitch |
| Package Height | — | 2.23 mm |
| Process | — | CMOS |
| Supply Voltage I/O | — | [DATA_NEEDED: I/O supply voltage range] |
| Embedded Memory | — | [DATA_NEEDED: Embedded RAM block capacity] |