A3PE3000L-1FGG484I vs A3PE3000L-1FGG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-1FGG484I sa pamamagitan ng Microchip Technology at A3PE3000L-1FGG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-1FGG484I - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484I ✓ NakahandaMicrochip Technology
A3PE3000L-1FGG484 - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-1FGG484I | A3PE3000L-1FGG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L | ProASIC3L |
| Number of Gates | 3000000 | — |
| Total RAM Bits | 516096 | — |
| Number of I/O | 341 | — |
| Volte ng Pagbibigay | 1.14 V to 1.575 V | — |
| Core Voltage (Nominal) | 1.2 V | — |
| Core Voltage Range (per datasheet) | 1.2 V to 1.5 V | — |
| Speed Grade | -1 | -1 |
| Packhaging / Kaso | 484-BGA | — |
| Supplier Device Package | 484-FPBGA (23x23) | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | -40C to +100C (TJ) | 0C to +70C |
| Technology | 130 nm Flash | — |
| Programmable Type | In System Programmable (flash-based, non-volatile) | — |
| Packaging | Tray | Tray |
| Tindminan RoHS | ROHS3 Compliant | [DATA_NEEDED: RoHS status] |
| Manufacturer Lead Time | 8 weeks | — |
| Product Status | Active | — |
| System Gates | — | 3,000,000 |
| Logic Cells | — | 75,264 |
| User I/Os (this package) | — | 341 |
| Maximum User I/Os (family) | — | 616 |
| Embedded SRAM | — | Up to 504 kbits true dual-port |
| Core Voltage | — | 1.2 V to 1.5 V |
| Supply Voltage (I/O) | — | 1.5 V (bank-dependent [DATA_NEEDED: exact I/O bank voltage range]) |
| Process Technology | — | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration | — | Nonvolatile flash, Instant On, single chip |
| Low Power Feature | — | Flash*Freeze technology |
| Packhaging | — | 484-ball FBGA (FG484), 23 x 23 mm, 1 mm pitch |
| Style ng Pagpapasok | — | SMD/SMT |
| Power-Up Mode | — | Live at power-up (Level 0 support) |