A3PE3000L-1FGG896 vs A3PE3000L-FGG896I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-1FGG896 sa pamamagitan ng Microchip Technology at A3PE3000L-FGG896I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ NakahandaMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-1FGG896 | A3PE3000L-FGG896I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L | ProASIC3L |
| System Gates | 3000000 | 3000000 |
| Logic Cells | 75264 | — |
| User I/O | 620 | — |
| Total Bits of RAM | [DATA_NEEDED: Total embedded RAM bits] | — |
| Core Voltage | 1.2 V (supports 1.2 V to 1.5 V) | — |
| I/O Voltage | As low as 1.2 V | — |
| Speed Grade | -1 | Standard (no speed suffix) |
| Process Technology | 130 nm flash | — |
| Configuration Memory | Nonvolatile flash (single-chip) | — |
| Special Features | Flash*Freeze technology | Flash*Freeze technology, single-chip solution |
| Packhaging | 896-ball FBGA (FGG896), 1.00 mm pitch | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (SMD/SMT) |
| Packaging | Tray | Tray, standard quantity 27 |
| Terminal Pitch | 1.00 mm | — |
| Technology Base | CMOS flash | — |
| Dynamic Power Reduction vs ProASIC3 | Approx. 40% | — |
| Static Power Reduction vs ProASIC3 | Approx. 50% | — |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| Volte ng Pagbibigay | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Packhaging / Kaso | — | 896-BGA (FBGA, 1 mm pitch) |
| Temperature na Operasyon | — | Industrial grade (I suffix) |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |