A3PE3000L-1FGG896I vs A3PE3000L-1FGG896 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-1FGG896I sa pamamagitan ng Microchip Technology at A3PE3000L-1FGG896 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-1FGG896I - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FGG896I ✓ NakahandaMicrochip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-1FGG896I | A3PE3000L-1FGG896 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L (Flash FPGAs with Flash*Freeze) | ProASIC3L |
| System Gates | 3000000 | 3000000 |
| User I/O | 620 | 620 |
| Embedded SRAM | 504 kbits true dual-port | — |
| Packhaging | 896-ball FBGA, 1 mm pitch | 896-ball FBGA (FGG896), 1.00 mm pitch |
| Speed Grade | -1 | -1 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V (supports 1.2 V to 1.5 V) |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm flash |
| PLLs | 6 | — |
| Maximum System Performance | Approx. 272 MHz | — |
| Configuration Technology | Nonvolatile flash, single-chip, Instant On | — |
| Low Power Feature | Flash*Freeze Technology | — |
| Temperature na Operasyon | -40C to +85C (industrial, I suffix) | — |
| Logic Family | CMOS | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Power-Up Support | Live at Power-Up Level 0 | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Logic Cells | — | 75264 |
| Total Bits of RAM | — | [DATA_NEEDED: Total embedded RAM bits] |
| I/O Voltage | — | As low as 1.2 V |
| Configuration Memory | — | Nonvolatile flash (single-chip) |
| Special Features | — | Flash*Freeze technology |
| Packaging | — | Tray |
| Terminal Pitch | — | 1.00 mm |
| Technology Base | — | CMOS flash |
| Dynamic Power Reduction vs ProASIC3 | — | Approx. 40% |
| Static Power Reduction vs ProASIC3 | — | Approx. 50% |