A3PE3000L-FG484 vs A3PE3000L-FGG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FG484 sa pamamagitan ng Microchip Technology at A3PE3000L-FGG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ NakahandaMicrochip Technology
A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip
A3PE3000L-FGG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-FG484 | A3PE3000L-FGG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 | 3,000,000 |
| Logic Cells / CLBs | 75264 | — |
| User I/Os | 341 | — |
| Maximum System Frequency | 250 MHz | — |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| Technology | 130 nm CMOS flash, nonvolatile | — |
| Configuration | Flash-based, Instant On, single-chip | — |
| Low Power Feature | Flash*Freeze technology | Flash*Freeze technology |
| Package Type | 484-ball FBGA (PBGA484) | — |
| Package Dimensions | 23 x 23 mm, 1 mm ball pitch | — |
| Package Height | 2.23 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Process | CMOS | — |
| Temperature na Operasyon | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| Supply Voltage I/O | [DATA_NEEDED: I/O supply voltage range] | — |
| Embedded Memory | [DATA_NEEDED: Embedded RAM block capacity] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance] | Compliant (per Newark: RoHS Compliant: Yes) |
| Logic Cells | — | 75,264 |
| User I/O | — | 341 |
| Embedded RAM | — | 516,096 bits |
| Core Voltage | — | 1.2 V to 1.5 V |
| Process Technology | — | 130 nm flash |
| Configuration Technology | — | Nonvolatile flash, Instant On |
| Packhaging | — | 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm, 1.0 mm pitch |
| Supply Voltage - I/O | — | [DATA_NEEDED: I/O bank voltage range] |
| Packaging | — | Tray |
| Security | — | Single-chip, flash-based, secure nonvolatile configuration |