A3PE3000L-FG484I vs A3PE3000L-FG484M Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FG484I sa pamamagitan ng Microchip Technology at A3PE3000L-FG484M sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip
A3PE3000L-FG484I ✓ NakahandaMicrochip Technology
A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-FG484M ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-FG484I | A3PE3000L-FG484M |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L (ProASIC3 Low Power) | ProASIC3L (Flash-based FPGA) |
| System Gates | 3000000 (3.00E6) | 3000000 (3.00E6) |
| Logic Cells (DFFs) | 75264 | — |
| User I/O (this package) | 341 | — |
| Max User I/O (family) | 616 | — |
| Embedded SRAM | 504 kbit true dual-port | — |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | 130-nm, 7-layer metal (6 copper) flash-based CMOS |
| Core Supply Voltage | 1.14 V to 1.575 V (1.2 V typical) | — |
| Configuration | Nonvolatile flash, Live-at-Power-Up Level 0 | — |
| Single-Chip Solution | Yes (no external configuration PROM) | Yes (no external configuration device required) |
| Temperature na Operasyon | -40C to +100C (TJ, industrial) | 0 to 70 C |
| Packhaging | 484-ball FBGA (23x23 mm, 1 mm pitch) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Speed | [DATA_NEEDED: speed grade / max frequency] | — |
| Tindminan RoHS | ROHS3 Compliant | — |
| Packaging | Tray | — |
| Manufacturer Lead Time | 8 weeks | — |
| Logic Family | CMOS | CMOS |
| Logic Elements (VersaTiles) | — | 75264 |
| True Dual-Port SRAM | — | 504 kbits |
| User I/O | — | 341 (up to 616 in larger packages) |
| Core Voltage | — | 1.2 V to 1.5 V |
| Configuration Memory | — | Nonvolatile on-chip flash, live at power-up (Level 0) |
| Low-Power Feature | — | Flash*Freeze technology |
| Volte ng Pagbibigay | — | 1.5 V |
| Package Type | — | FBGA-484, 1 mm pitch, 23 x 23 mm |
| Pins / Balls | — | 484 |