A3PE3000L-FG896 vs A3PE3000L-FGG896I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FG896 sa pamamagitan ng Microchip Technology at A3PE3000L-FGG896I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-FG896 - ProASIC3L Low Power FPGA 620 I/O | Microchip
A3PE3000L-FG896 ✓ NakahandaMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-FG896 | A3PE3000L-FGG896I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L | ProASIC3L |
| System Gates | 3,000,000 | 3000000 |
| User I/O | 620 | — |
| Logic Cells | 75,264 | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Technology | 130 nm nonvolatile flash | — |
| Configuration Memory | Nonvolatile flash (single-chip, Instant On) | — |
| Packhaging | 896-ball FBGA | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (SMD/SMT) |
| Low Power Feature | Flash*Freeze technology | — |
| Max Operating Frequency | [DATA_NEEDED: max operating frequency] | — |
| Embedded Memory | [DATA_NEEDED: embedded memory size] | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | Industrial grade (I suffix) |
| Operating Temperature Suffix | Commercial (unmarked suffix; -I grade is industrial) | — |
| Tindminan RoHS | unknown | [DATA_NEEDED: RoHS status] |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Programmability | In-system reprogrammable | — |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| Volte ng Pagbibigay | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| Packhaging / Kaso | — | 896-BGA (FBGA, 1 mm pitch) |
| Packaging | — | Tray, standard quantity 27 |
| Speed Grade | — | Standard (no speed suffix) |