A3PE3000L-FGG484 vs A3PE3000-2FG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FGG484 sa pamamagitan ng Microchip Technology at A3PE3000-2FG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip
A3PE3000L-FGG484 ✓ NakahandaMicrochip Technology
A3PE3000-2FG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-2FG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-FGG484 | A3PE3000-2FG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3E Flash FPGAs |
| System Gates | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | — |
| User I/O | 341 | 341 |
| Embedded RAM | 516,096 bits | — |
| Core Voltage | 1.2 V to 1.5 V | 1.5 V |
| Process Technology | 130 nm flash | — |
| Configuration Technology | Nonvolatile flash, Instant On | — |
| Low Power Feature | Flash*Freeze technology | — |
| Packhaging | 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm, 1.0 mm pitch | 484-ball FBGA (FG484) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Supply Voltage - I/O | [DATA_NEEDED: I/O bank voltage range] | — |
| Tindminan RoHS | Compliant (per Newark: RoHS Compliant: Yes) | Non-G suffix (standard package); G-suffix variants are RoHS-compliant |
| Packaging | Tray | — |
| Security | Single-chip, flash-based, secure nonvolatile configuration | — |
| Logic Cells (DFF-equivalent) | — | 75,264 |
| VersaTiles | — | 75,264 |
| Embedded SRAM | — | 516,096 bits |
| Technology | — | 130 nm CMOS flash process |
| Maximum System Performance | — | 310 MHz |
| Speed Grade | — | -2 |
| Configuration | — | Non-volatile Flash (single-chip, instant-on) |
| Soft ARM Support | — | Yes (optional Cortex-M1 soft core) |
| Operating Temperature (commercial) | — | 0C to +85C |
| I/O Standards | — | Voltage-referenced I/O supported (VREF per minibank) |