AFS600-1FG256I vs M7AFS600-FG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng AFS600-1FG256I sa pamamagitan ng Microchip Technology at M7AFS600-FG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
AFS600-1FG256I - 600K-Gate Fusion Mixed-Signal FPGA | Microchip
AFS600-1FG256I ✓ NakahandaMicrochip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | AFS600-1FG256I | M7AFS600-FG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | Fusion mixed-signal field-programmable gate array (FPGA) | — |
| System Gates | 600,000 gates | 600K |
| Logic Family | Flash-based CMOS | — |
| I/O Count | 119 I/O | — |
| Volte ng Pagbibigay | 1.5 V | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Metal Layers | 7 layers | — |
| Packhaging | 256-LBGA, 1 mm pitch | — |
| Bilang ng Pin | 256 pins | — |
| Temperature na Operasyon | 0°C to 85°C | — |
| Configuration Memory | Nonvolatile flash | — |
| Power-Up Behavior | Live at power-up (LAPU) | — |
| Integrated Resources | Configurable analog, large flash memory blocks, clock generation and management | — |
| Programmable Logic | High-performance flash-based programmable logic | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance status] | — |
| REACH Compliance | [DATA_NEEDED: REACH compliance status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Junction Test Temperature | 100°C | — |
| Series | — | M7AFS600 (Fusion) |
| Logic Capacity (DigiKey listing) | — | 110592 |
| Number of I/O | — | 119 I/O |
| Embedded Processor | — | ARM CoreMP7 |
| Core Supply Voltage | — | 1.5 V |
| Packhaging / Kaso | — | 256-LBGA (FBGA) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Style ng Pagpapasok | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Packaging | — | Tray |
| Programmable Logic Type | — | Flash-based, non-volatile |
| Analog Integration | — | Mixed-signal (configurable analog + flash memory) |