AFS600-FG256I vs M1AFS600-2FG256 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng AFS600-FG256I sa pamamagitan ng Microchip Technology at M1AFS600-2FG256 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology
AFS600-FG256I ✓ NakahandaMicrochip Technology
M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FG256 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | AFS600-FG256I | M1AFS600-2FG256 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | Fusion mixed-signal FPGA | — |
| System Gates | 600,000 gates | 600000 gates |
| Configurable Logic Blocks | 13,824 CLBs | — |
| User I/O | 119 I/O | — |
| Volte ng Pagbibigay | 1.5 V | — |
| Process Technology | 130 nm CMOS | — |
| Metal Layers | 7 layers | — |
| Configuration Memory | Nonvolatile flash memory | — |
| Power-Up Feature | Live at Power-Up (LAPU) | — |
| Logic Family | CMOS | — |
| Package Type | 256-LBGA | — |
| Package Pitch | 1.0 mm | — |
| Number of Package Balls | 256 balls | — |
| Package Shape | Square | — |
| Uri ng Pagpapasok | Surface mount | — |
| Temperature na Operasyon | 0 C to 70 C | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Series | — | M1AFS600 (Fusion) |
| Logic Elements | — | 110592 |
| Embedded Processor | — | ARM Cortex-M1 |
| Number of I/Os | — | 119 I/O |
| Core Supply Voltage | — | 1.5 V |
| Technology | — | 130 nm flash-based |
| Packhaging / Kaso | — | 256-LBGA (FBGA-256) |
| Style ng Pagpapasok | — | SMD/SMT |
| Operating Temperature - Minimum | — | 0 C |
| Operating Temperature - Maximum | — | +70 C |
| Packaging | — | Tray |
| Analog Peripherals | — | Configurable analog block (Fusion mixed-signal) |
| On-chip Memory | — | Large flash memory blocks |
| Clock Management | — | On-chip clock generation and management (PLL) |
| Configuration | — | Flash-based, live at power-up, no external config PROM required |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum fabric operating frequency] |