AFS600-FG256I vs M1AFS600-2FG256 比較

詳細並排比較 AFS600-FG256I 由 Microchip Technology 與 M1AFS600-2FG256 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
AFS600-FG256I AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology

AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology

AFS600-FG256I ✓ 啟用中
Microchip Technology
M1AFS600-2FG256 M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 ✓ 啟用中

規格比較

參數 AFS600-FG256I M1AFS600-2FG256
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Device Type Fusion mixed-signal FPGA —
System Gates 600,000 gates 600000 gates
Configurable Logic Blocks 13,824 CLBs —
User I/O 119 I/O —
供應電壓 1.5 V —
Process Technology 130 nm CMOS —
Metal Layers 7 layers —
Configuration Memory Nonvolatile flash memory —
Power-Up Feature Live at Power-Up (LAPU) —
Logic Family CMOS —
Package Type 256-LBGA —
Package Pitch 1.0 mm —
Number of Package Balls 256 balls —
Package Shape Square —
安裝類型 Surface mount —
工作溫度 0 C to 70 C —
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Series — M1AFS600 (Fusion)
Logic Elements — 110592
Embedded Processor — ARM Cortex-M1
Number of I/Os — 119 I/O
Core Supply Voltage — 1.5 V
Technology — 130 nm flash-based
封裝 / 外殼 — 256-LBGA (FBGA-256)
安裝方式 — SMD/SMT
Operating Temperature - Minimum — 0 C
Operating Temperature - Maximum — +70 C
Packaging — Tray
Analog Peripherals — Configurable analog block (Fusion mixed-signal)
On-chip Memory — Large flash memory blocks
Clock Management — On-chip clock generation and management (PLL)
Configuration — Flash-based, live at power-up, no external config PROM required
Maximum Operating Frequency — [DATA_NEEDED: maximum fabric operating frequency]

資料表與資源

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