AFS600-FG256I vs M7AFS600-FGG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng AFS600-FG256I sa pamamagitan ng Microchip Technology at M7AFS600-FGG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology
AFS600-FG256I ✓ NakahandaMicrochip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | AFS600-FG256I | M7AFS600-FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | Fusion mixed-signal FPGA | — |
| System Gates | 600,000 gates | 600K |
| Configurable Logic Blocks | 13,824 CLBs | — |
| User I/O | 119 I/O | 119 |
| Volte ng Pagbibigay | 1.5 V | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Metal Layers | 7 layers | — |
| Configuration Memory | Nonvolatile flash memory | — |
| Power-Up Feature | Live at Power-Up (LAPU) | — |
| Logic Family | CMOS | — |
| Package Type | 256-LBGA | — |
| Package Pitch | 1.0 mm | — |
| Number of Package Balls | 256 balls | — |
| Package Shape | Square | — |
| Uri ng Pagpapasok | Surface mount | Surface Mount |
| Temperature na Operasyon | 0 C to 70 C | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Family | — | Fusion Mixed-Signal FPGA |
| Packhaging | — | 256-LBGA (FBGA), 1 mm ball pitch |
| Core Voltage | — | 1.5 V |
| Maximum System Frequency | — | 1098.9 MHz (per distributor parametric listing) |
| Embedded Processor | — | ARM CoreMP7 |
| Fabric Type | — | Flash-based, non-volatile, instant-on |
| Analog Subsystem | — | Integrated configurable analog (per Microchip Fusion family page) |
| On-chip Flash Memory | — | Yes (large flash memory blocks, per Microchip Fusion family page) |
| Clock Management | — | Integrated clock generation and management circuitry (PLLs) |
| Temperature Grade | — | Industrial (I suffix) |
| Hanay ng Temperature na Operasyon | — | -40C to +85C (industrial grade standard range) |
| Packaging | — | Tray |
| Level ng MSL | — | [DATA_NEEDED: MSL Level] |
| Thermal Resistance (theta_JA) | — | [DATA_NEEDED: Thermal Resistance] |