AFS600-FGG256I vs M7AFS600-FGG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng AFS600-FGG256I sa pamamagitan ng Microchip Technology at M7AFS600-FGG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
AFS600-FGG256I - 600K Gate Fusion FPGA | Microchip Technology
AFS600-FGG256I ✓ NakahandaMicrochip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | AFS600-FGG256I | M7AFS600-FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| System Gates | 600,000 gates | 600K |
| Device Type | Fusion mixed-signal FPGA | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Metal Layers | 7 layers | — |
| Configuration Memory | Nonvolatile flash | — |
| Power-Up Configuration | Live at Power-Up (LAPU) | — |
| System Performance Frequency | 350 MHz | — |
| Volte ng Pagbibigay | 1.5 V | — |
| Logic Family | CMOS | — |
| Total Pin Count | 256 pins | — |
| Package Type | BGA-256 | — |
| Package Pitch | 1.0 mm | — |
| Package Form | Square | — |
| Terminal Type | Ball | — |
| Temperature na Operasyon | 0°C to +70°C | — |
| Temperature Grade | Industrial | Industrial (I suffix) |
| Programmable Analog Resources | Configurable analog blocks | — |
| Embedded Flash | Large flash memory blocks | — |
| Clock Management | Comprehensive clock generation and management circuitry | Integrated clock generation and management circuitry (PLLs) |
| Programming Interface | [DATA_NEEDED: programming interface] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Maximum I/O Current | [DATA_NEEDED: maximum I/O current] | — |
| Junction Temperature | [DATA_NEEDED: junction temperature rating] | — |
| Family | — | Fusion Mixed-Signal FPGA |
| User I/O | — | 119 |
| Packhaging | — | 256-LBGA (FBGA), 1 mm ball pitch |
| Core Voltage | — | 1.5 V |
| Maximum System Frequency | — | 1098.9 MHz (per distributor parametric listing) |
| Embedded Processor | — | ARM CoreMP7 |
| Fabric Type | — | Flash-based, non-volatile, instant-on |
| Analog Subsystem | — | Integrated configurable analog (per Microchip Fusion family page) |
| On-chip Flash Memory | — | Yes (large flash memory blocks, per Microchip Fusion family page) |
| Hanay ng Temperature na Operasyon | — | -40C to +85C (industrial grade standard range) |
| Uri ng Pagpapasok | — | Surface Mount |
| Packaging | — | Tray |
| Level ng MSL | — | [DATA_NEEDED: MSL Level] |
| Thermal Resistance (theta_JA) | — | [DATA_NEEDED: Thermal Resistance] |