ATSAMA5D27C-D1G-CU vs ATSAMA5D27C-D5M-CU Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng ATSAMA5D27C-D1G-CU sa pamamagitan ng Microchip Technology at ATSAMA5D27C-D5M-CU sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
ATSAMA5D27C-D1G-CU - Cortex-A5 MPU 500MHz 1Gbit DDR2 | Microchip
ATSAMA5D27C-D1G-CU ✓ NakahandaMicrochip Technology
ATSAMA5D27C-D5M-CU - 500MHz Cortex-A5 MPU, 512Mb DDR2 SiP | Microchip
ATSAMA5D27C-D5M-CU ✓ NakahandaPagsanggunian na paghahambing
| Parametro | ATSAMA5D27C-D1G-CU | ATSAMA5D27C-D5M-CU |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Core Architecture | ARM Cortex-A5 (ARMv7-A) | — |
| Core Count | 1 | — |
| Maximum CPU Clock | 500 MHz | — |
| Bit Width | 32-bit | — |
| Integrated Memory | 1 Gbit DDR2 SDRAM (16-bit data bus) | — |
| Volte ng Pagbibigay | 3.3 V I/O | — |
| Core Voltage | 1.2 V | — |
| Packhaging | 289-TFBGA (14x14 mm), 0.8 mm ball pitch | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Ethernet | 10/100 Mbps (1x EMAC, external PHY) | Dual 10/100 GMAC with 1588 PTP |
| USB | USB 2.0 High-Speed with HSIC | USB HSIC + 2x USB 2.0 High-Speed |
| Temperature na Operasyon | Industrial (-40C to +85C) | -40°C to +85°C (Industrial) |
| Tindminan RoHS | Compliant (Green, BGA GREEN) | Compliant |
| Packaging | Tray | — |
| Series | SAMA5D2 SiP | — |
| Part Status | — | Active |
| Core Processor | — | ARM Cortex-A5 |
| Number of Cores / Bus Width | — | 1 Core, 32-Bit |
| Speed | — | 500 MHz |
| Co-Processors / DSP | — | ARM NEON, FPU |
| RAM Controllers | — | DDR2/LPDDR2 (integrated 512 Mbit DDR2 SiP) |
| Graphics Acceleration | — | Yes (2D) |
| Peripheral Touch Controller | — | Yes (16-bit databus) |
| Audio Subsystem | — | I2S, class-D amplifier interface |
| CAN | — | 2x CAN-FD |
| Serial Interfaces | — | 3x FLEXCOM (USART/SPI/TWI), 2x SD/MMC, 1x I2C, 1x SPI, 1x UART |
| Image Sensor Interface | — | Yes |
| Packhaging / Kaso | — | 289-LFBGA (14x14 mm, 0.8 mm ball pitch) |