ATSAME70Q19A-CN vs ATSAME70N21B-CN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng ATSAME70Q19A-CN sa pamamagitan ng Microchip Technology at ATSAME70N21B-CN sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
ATSAME70Q19A-CN - 300MHz Cortex-M7 MCU 512KB Flash LFBGA-144 | Microchip
ATSAME70Q19A-CN ✓ NakahandaMicrochip Technology
ATSAME70N21B-CN - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
ATSAME70N21B-CN ✓ NakahandaPagsanggunian na paghahambing
| Parametro | ATSAME70Q19A-CN | ATSAME70N21B-CN |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Core Architecture | ARM Cortex-M7 with FPU (single + double precision) | ARM Cortex-M7 with single/double-precision FPU |
| Maximum CPU Clock | 300 MHz | 300 MHz |
| Flash Memory | 512 KB | 2 MB (2M x 8), dual-bank |
| SRAM | 256 KB | 384 KB (256 KB SRAM0 with ECC + 128 KB SRAM1) |
| Operating Voltage (VDDCORE) | 1.2 V (typical) | — |
| I/O Voltage (VDDIO) | 3.3 V (typical) | — |
| Packhaging | 144-LFBGA (10x10 mm, 0.8 mm pitch) | 100-ball TFBGA (9x9 mm) |
| Temperature na Operasyon | -40C to +105C (industrial) | -40C to +85C (industrial) |
| ADC | 12-bit, up to 2 Msps | 1x 12-bit, up to 1.2 Msps |
| DAC | 12-bit | 2x 12-bit, 1 Msps (dual 2-channel) |
| USB | USB 2.0 High-Speed Host + Device with on-chip PHY | USB 2.0 High-Speed Host/Device with integrated HS PHY |
| Ethernet | 10/100 Mbps MAC (GMAC) with 1588 PTP | 10/100 Mbps MAC + GMAC (Gigabit) |
| CAN | 2x CAN-FD controllers | 2x CAN-FD controllers |
| Serial Interfaces | 3x FLEXCOM (USART/SPI/TWI), 2x I2S, 2x SPI high-speed | — |
| DMA Channels | 24 (XDMAC) | — |
| Crypto Accelerator | AES, SHA, TRNG hardware blocks | AES, SHA, TRNG |
| External Bus Interface (EBI) | Yes (SDRAM, SRAM, NAND support) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | 3 | — |
| Tindminan RoHS | Compliant | Compliant |
| CoreMark Performance | — | 1500 CoreMark |
| DMIPS | — | 600 DMIPS |
| Supply Voltage (VDDIN) | — | 1.2 V (typ) |
| External Bus | — | 16-bit HSIF (High-Speed Interface) |