EP1C12F256C6 vs EP1C6F256C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1C12F256C6 sa pamamagitan ng Intel at EP1C6F256C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1C12F256C6 | EP1C6F256C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Series | Cyclone I | — |
| Logic Elements | 12,060 | 5,980 |
| Logic Array Blocks (LABs) | 1,206 | 598 |
| Embedded RAM Bits | 239,616 bits (52 M4K blocks) | — |
| Embedded 18x18 Multipliers | 17 | — |
| Maximum User I/Os | 185 | — |
| PLLs | 2 | 2 |
| Process Technology | 130 nm SRAM, 1.5 V core | 0.13 µm SRAM |
| Packhaging | 256-BGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) | 256-ball FineLine BGA (FBGA) |
| Temperature na Operasyon | 0C to +85C (commercial, C6 speed grade) | 0 °C to 85 °C (commercial) |
| Speed Grade | C6 (mid-tier) | C6 |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | — |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL-2/3, PCI | — |
| LVDS Data Rate | Up to 640 Mbps | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | — | Cyclone |
| Total RAM Bits | — | 92,160 |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: embedded multiplier count] |
| User I/O Pins | — | 185 |
| Core Voltage | — | 1.5 V |
| Package Dimensions | — | 17 mm × 17 mm |
| Configuration Method | — | JTAG, serial (EPCS), passive serial |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS compliance status] |