EP1C12F324C7N vs EP1C12F324C8L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1C12F324C7N sa pamamagitan ng Intel at EP1C12F324C8L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1C12F324C7N | EP1C12F324C8L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Series | Cyclone | — |
| Family | Cyclone I | Cyclone |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LEs) | 12,060 | — |
| Logic Array Blocks (LABs) | 1,206 | — |
| Embedded Memory (bits) | 239,616 | — |
| Maximum User I/O | 249 | — |
| Number of PLLs | 2 | — |
| Process Technology | 130 nm CMOS | CMOS, 130 nm |
| Core Voltage | 1.5 V | — |
| Supply Voltage na Operasyon | 1.5 V to 3.3 V | — |
| Maximum Internal Frequency | 320 MHz | — |
| Speed Grade | C7 (commercial, -40C to 85C; spec datasheet: 0C to 85C) | 8 |
| Packhaging / Kaso | 324-BGA (FBGA-324, 19 x 19 mm, 1.0 mm pitch) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Configuration Method | AS / PS / JTAG | — |
| Tindminan RoHS | Compliant (N suffix = lead-free) | Compliant |
| Temperature na Operasyon | [DATA_NEEDED: precise commercial temperature range per datasheet] | 0C to +85C (commercial) |
| Logic Elements | — | 12,060 |
| Embedded RAM Bits | — | 239,616 |
| M4K RAM Blocks | — | 52 |
| User I/O Pins | — | 249 |
| PLLs | — | 2 |
| Packhaging | — | FBGA-324 |
| Package Body Size | — | 19 x 19 mm |
| Ball Pitch | — | 1.0 mm |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Power Variant | — | Low-power (L suffix) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |