EP1C4F324C7 vs EP1C4F324C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1C4F324C7 sa pamamagitan ng Intel at EP1C4F324C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1C4F324C7 | EP1C4F324C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Series | Cyclone | — |
| Logic Elements | 4 000 | 4000 |
| Logic Array Blocks / CLBs | 400 CLBs | 249 LABs |
| Embedded Memory (Bits) | 78 336 | — |
| Maximum User I/O | 249 | — |
| Packhaging | 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Internal Frequency (max, family ref) | 405 MHz | — |
| Temperature na Operasyon | Commercial (0 °C to +85 °C) inferred from speed grade C7 | 0C to +85C (commercial) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | Passive Serial, Active Serial, JTAG |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Process Technology | CMOS, 130 nm-class (Cyclone generation) | 0.13 um SRAM-based CMOS |
| Tindminan RoHS | Compliant (lead-free FBGA) | Compliant (lead-free FBGA) |
| Level ng MSL | 3 (per JEDEC J-STD-020, typical for BGA-324) | — |
| Device Family | — | Cyclone |
| Total RAM Bits | — | 78336 bits (~9.6 KB) |
| Maximum User I/Os | — | 249 |
| PLLs | — | 2 |
| Package Type | — | FBGA-324 (FineLine BGA) |
| Package Dimensions | — | 19 x 19 mm, 1.0 mm ball pitch |
| Speed Grade | — | C7 (commercial, mid-speed) |
| Internal Frequency (max) | — | 405 MHz |
| Embedded Multipliers | — | Yes (DSP blocks) |