EP1C4F324C7N vs EP1C4F324C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1C4F324C7N sa pamamagitan ng Intel at EP1C4F324C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1C4F324C7N | EP1C4F324C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Device Family | Cyclone | Cyclone |
| Logic Elements | 4000 | — |
| Logic Array Blocks / CLBs | 249 LABs | — |
| Total RAM Bits | 78336 bits (~9.6 KB) | 78,336 |
| Maximum User I/Os | 249 | 249 |
| PLLs | 2 | 2 |
| Package Type | FBGA-324 (FineLine BGA) | — |
| Package Dimensions | 19 x 19 mm, 1.0 mm ball pitch | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 0.13 um SRAM-based CMOS | 130 nm |
| Speed Grade | C7 (commercial, mid-speed) | — |
| Internal Frequency (max) | 405 MHz | — |
| Configuration Modes | Passive Serial, Active Serial, JTAG | — |
| Embedded Multipliers | Yes (DSP blocks) | — |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Tindminan RoHS | Compliant (lead-free FBGA) | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Logic Elements (LE) | — | 4,000 |
| Logic Array Blocks (LAB) | — | 400 |
| Embedded Multipliers (17x17) | — | 20 |
| M4K RAM Blocks | — | 17 |
| Global Clock Networks | — | 8 |
| Internal Operating Frequency | — | 405 MHz |
| Packhaging | — | 324-ball FBGA, 19 x 19 mm, 1.0 mm pitch |
| Configuration Method | — | SRAM-based, JTAG/Active Serial |