EP1K100FI256-2N vs EP1K50FC256-2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K100FI256-2N sa pamamagitan ng Intel at EP1K50FC256-2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K100FI256-2N | EP1K50FC256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | ACEX 1K | ACEX-1K |
| Series | EP1K100 | — |
| Logic Elements | 4,992 | — |
| System Gates | 100,000 | — |
| Logic Array Blocks (LABs) | 624 | 360 |
| Embedded Array Blocks (EABs) | 6 | 10 |
| Total RAM Bits | 49,152 | — |
| Maximum User I/O | 186 | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS SRAM |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| Speed Grade | -2 (faster bin) | -2 |
| Ball Finish | Leaded (SnPb) - 'N' suffix | — |
| Temperature na Operasyon | -40 °C to +85 °C (Industrial) | 0 °C to 70 °C (Commercial) |
| Packhaging | 256-ball FineLine BGA (FBGA-256) | 256-ball FBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Configuration Interface | JTAG (IEEE 1149.1) + serial modes | — |
| Tindminan RoHS | Non-compliant (leaded 'N' ball finish) | [DATA_NEEDED: RoHS status] |
| Logic Elements (LEs) | — | 2,880 |
| Typical Gates | — | 50,000 |
| Embedded Memory (bits) | — | 40,960 |
| Maximum User I/O Pins | — | 186 |
| Core Voltage (VCCINT) | — | 2.5 V (2.375 V to 2.625 V) |
| Package Dimensions | — | 16 x 16 mm |
| Configuration Method | — | JTAG / Passive Serial |