EP1K30FC256-3N vs EP1K30FC256-3NAA Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP1K30FC256-3N sa pamamagitan ng Intel at EP1K30FC256-3NAA sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP1K30FC256-3N EP1K30FC256-3NAA
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Obsolete
Family ACEX 1K ACEX-1K
Logic Elements / Cells 17,288 logic elements (1,728 cells) —
Typical Gates 30,000 —
Total RAM Bits 24,576 —
Number of LABs 216 —
User I/Os 171 —
Core Supply Voltage 2.375 V to 2.625 V (nominal 2.5 V) 2.5 V
Technology 0.22 µm CMOS, SRAM configuration —
Speed Grade -3 -3 (ordering code)
Propagation Delay (typ.) 0.6 ns —
Maximum Frequency 200 MHz —
Packhaging 256-ball FineLine BGA (FBGA-256) —
Uri ng Pagpapasok Surface Mount Surface Mount
Temperature na Operasyon 0 °C to +70 °C (commercial) —
Configuration SRAM, serial/parallel, JTAG ISP (IEEE 1149.1) —
Product Category — FPGA - Field Programmable Gate Array
Number of Logic Elements — 1728
Number of Gates — 30000 (30K)
Embedded RAM Bits — 24576 bits
Number of User I/Os — 171
Maximum Internal Clock Frequency — 200 MHz
IC Process Technology — 0.22 um
Package Type — 256-ball FBGA (FineLine BGA)
Package Form — 256-BBGA
Configuration Type — SRAM-based, external configuration device required
Hanay ng Temperature na Operasyon — [DATA_NEEDED: operating temperature range]
I/O Supply Voltage — [DATA_NEEDED: VCCIO voltage options]
Power Dissipation — [DATA_NEEDED: typical power dissipation, design dependent]
Lead-Free / RoHS — [DATA_NEEDED: manufacturer PCN confirms RoHS status]

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